XC7K70T-1FBG676I

The XC7K70T-1FBG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC by AMD. It provides 65,600 logic elements, approximately 4.98 Mbits of embedded memory, and 300 general-purpose I/O in a 676-FCBGA package (27 × 27 mm).

Designed for surface-mount applications, this device operates over an industrial temperature range (−40 °C to 100 °C) and uses a core supply voltage between 0.97 V and 1.03 V. It is RoHS compliant.

Key Features

• Core Logic  65,600 logic elements provide a substantial programmable fabric for implementing custom digital logic and control functions.
• Embedded Memory  Approximately 4.98 Mbits of on-chip RAM enable local buffering, state storage, and deterministic data handling without external memory.
• I/O Density  300 I/O pins support a wide range of external interfaces and board-level connectivity requirements.
• Package  676-FCBGA (676-BBGA) supplier device package, 27 × 27 mm, optimized for compact, high-density PCB layouts.
• Power  Core voltage supply range of 0.97 V to 1.03 V for system power budgeting and regulator selection.
• Temperature Range  Rated for industrial operation from −40 °C to 100 °C to meet harsher environmental requirements.
• Mounting & Compliance  Surface-mount device with RoHS compliance for modern manufacturing and regulatory requirements.

Typical Applications

• Industrial Control & Automation  The industrial temperature rating and dense logic/memory resources make this FPGA suitable for control, sequencing, and deterministic logic tasks in industrial systems.
• Custom Logic & Prototyping  Use the on-chip resources and 65,600 logic elements to implement and iterate custom digital functions and system prototypes.
• High‑Density I/O Designs  300 I/O pins support designs that require multiple parallel interfaces, signal aggregation, or board-level interconnect flexibility.

Unique Advantages

• Highly integrated logic and memory: Combining 65,600 logic elements with approximately 4.98 Mbits of embedded RAM reduces the need for external components and simplifies board design.
• Compact, board-friendly package: The 676-FCBGA (27 × 27 mm) package delivers high pin count in a compact footprint for space-constrained applications.
• Industrial temperature capability: Rated from −40 °C to 100 °C to support deployments in demanding environmental conditions.
• Tight core-voltage specification: A narrow supply window (0.97 V–1.03 V) enables predictable power budgeting and regulator selection.
• RoHS compliant: Meets lead-free manufacturing requirements for modern production processes.

Why Choose XC7K70T-1FBG676I?

The XC7K70T-1FBG676I positions a substantial programmable fabric and on-chip memory in a compact 676-FCBGA package with industrial-grade temperature capability. Its combination of 65,600 logic elements, approximately 4.98 Mbits of embedded RAM, and 300 I/O pins makes it a practical choice where board space, deterministic on-chip resources, and robust operating temperature are priorities.

This device is suitable for designers seeking a mid-to-high density Kintex®-7 FPGA from AMD with clear electrical and environmental specifications to support scalable, long-lived designs.

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