XC7K70T-1FBV484C

The XC7K70T-1FBV484C is a Kintex®-7 series FPGA IC from AMD, supplied in a 484-FCBGA (23×23) package. It delivers a balanced combination of programmable logic capacity, on-chip memory, and a high I/O count for commercial embedded applications.

Designed for surface-mount assembly and RoHS-compliant manufacturing, this device targets commercial designs that require flexible digital logic, moderate embedded memory, and a compact BGA footprint operating within a 0 °C to 85 °C range.

Key Features

• Logic Capacity 65,600 logic elements organized across 5,125 configurable logic blocks (CLBs) to implement custom digital logic and control functions.
• Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffering, state storage, and intermediate data processing.
• I/O and Packaging 285 user I/Os delivered in a 484-FCBGA package (23×23 mm nominal) to support dense external connectivity in a compact footprint.
• Power Core voltage supply range of 0.970 V to 1.03 V to match system power-rail planning and regulator selection.
• Operating Range and Grade Commercial grade device rated for 0 °C to 85 °C operation and compliant with RoHS environmental requirements.
• Mounting Surface-mount FCBGA package suitable for automated PCB assembly processes.

Typical Applications

• Custom Logic and Control Implement application-specific state machines, glue logic, and control functions using the device's 65,600 logic elements and 5,125 CLBs.
• Buffering and Local Data Storage Use approximately 4.98 Mbits of embedded RAM for data buffering, frame storage, or intermediate computation in embedded systems.
• High-Density I/O Interfaces Deploy the 285 I/Os in compact systems requiring multiple external interfaces or parallel connections within a 484-FCBGA footprint.
• Commercial Embedded Designs Integrate into commercial temperature-range products where surface-mount assembly and RoHS compliance are required.

Unique Advantages

• Generous Logic Resources: 65,600 logic elements and 5,125 CLBs enable substantial custom logic implementation without external ASIC development.
• On-Chip Memory for Efficient Data Handling: Approximately 4.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and temporary-storage tasks.
• High I/O Count in a Compact Package: 285 I/Os in a 484-FCBGA (23×23) package allow dense connectivity while maintaining a small PCB footprint.
• Tight Core Voltage Specification: A defined supply range of 0.970 V to 1.03 V simplifies power-supply design and margining for the FPGA core.
• Commercial Temperature and RoHS Compliance: Rated for 0 °C to 85 °C and RoHS-compliant to meet common commercial manufacturing and environmental requirements.
• Surface-Mount Assembly Friendly: FCBGA mounting supports standard automated PCB assembly workflows.

Why Choose XC7K70T-1FBV484C?

The XC7K70T-1FBV484C positions itself as a versatile Kintex®-7 FPGA for commercial embedded designs that need a substantial logic fabric, on-chip memory, and a high count of I/Os in a compact FCBGA package. Its defined core voltage range and RoHS compliance make it suitable for standardized manufacturing and power designs.

This device is well suited for engineering teams requiring programmable logic capacity, moderate embedded memory resources, and dense external connectivity within a commercial temperature range. Its combination of features supports scalable design iterations and integration into surface-mount production flows.

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