XC7K70T-2FBG676C

The XC7K70T-2FBG676C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD supplied in a 676-ball FCBGA package (27 × 27 mm). It consolidates programmable logic, on-chip memory and I/O resources in a commercial-grade, surface-mount component intended for mid-range FPGA designs.

Key on-chip resources include 5,125 CLBs, 65,600 logic elements, approximately 4.98 Mbits of embedded memory and up to 300 I/O pins. The device operates from a core supply range of 970 mV to 1.03 V and is rated for 0 °C to 85 °C ambient operation.

Key Features

• Programmable Logic Provides 5,125 CLBs and 65,600 logic elements to implement custom digital logic and control functions.
• Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffering, state storage and block memory functions within the FPGA fabric.
• I/O Capacity Up to 300 programmable I/O pins to interface with external devices, peripherals and board-level signals.
• Package & Mounting 676-ball BGA FCBGA package (676-FCBGA, 27 × 27 mm) designed for surface-mount assembly on standard PCBs.
• Power Core voltage supply range of 970 mV to 1.03 V to match typical Kintex‑7 core requirements.
• Commercial Temperature Grade Rated for operation from 0 °C to 85 °C for commercial-environment deployments.
• RoHS Compliance RoHS‑compliant device meeting common lead‑free manufacturing requirements.

Unique Advantages

• Balanced logic and memory resources: Combination of 65,600 logic elements and approximately 4.98 Mbits of embedded RAM supports control, signal processing and buffering without immediate external memory dependency.
• Substantial I/O count: Up to 300 I/O pins allow flexible connectivity to sensors, peripherals and board-level interfaces.
• Standard surface-mount package: 676-FCBGA (27 × 27 mm) enables high-density PCB integration while supporting automated assembly processes.
• Commercial temperature rating: Specified 0 °C to 85 °C operation for designs targeted at commercial electronic products.
• RoHS compliant: Supports lead‑free manufacturing and regulatory requirements for many global markets.

Why Choose XC7K70T-2FBG676C?

The XC7K70T-2FBG676C positions itself as a mid-range Kintex‑7 FPGA offering a balanced mix of programmable logic, embedded memory and I/O capacity in a compact 676-ball FCBGA package. Its specification set — including 5,125 CLBs, 65,600 logic elements, approximately 4.98 Mbits of on-chip RAM and up to 300 I/O — makes it suitable for designs that require substantial on-chip resources without moving to larger device classes.

With a defined core supply range and commercial temperature rating, this device is appropriate for professional and production-level electronic products where RoHS compliance and surface-mount assembly are required. The combination of resources and packaging supports scalable designs that leverage the Kintex‑7 architecture while maintaining a clear upgrade path within the same device family.

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