XC7K70T-3FBG676E

The XC7K70T-3FBG676E is a Kintex®-7 field programmable gate array (FPGA) from AMD designed for mid-to-high density programmable logic applications. It provides 65,600 logic elements, approximately 4.98 Mbits of embedded memory (4,976,640 bits) and up to 300 I/O pins in a 676-ball FCBGA package (676-FCBGA, 27x27).

This device is delivered as a surface-mount, extended-grade FPGA with a nominal supply range of 0.970 V to 1.030 V and an operating temperature range of 0 °C to 100 °C. The package and configuration are suited to designs that require significant on-chip logic and memory while maintaining a compact, high-density footprint.

Key Features

• Core Architecture Kintex®-7 FPGA family device offering programmable logic resources in a single-chip FPGA IC.
• Logic Capacity 65,600 logic elements to implement complex digital functions and custom logic blocks.
• Embedded Memory Approximately 4.98 Mbits of on-chip RAM (4,976,640 bits) to support buffering, FIFOs and data storage within the FPGA fabric.
• I/O Resources Up to 300 general-purpose I/O pins to interface with external devices and systems.
• Package & Mounting 676-ball FCBGA package (676-FCBGA, 27x27) / 676-BBGA form factor, intended for surface-mount assembly.
• Power Core supply voltage range specified from 0.970 V to 1.030 V for the device core.
• Temperature & Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Environmental Compliance RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Implement custom datapaths and parallel processing using the device's 65,600 logic elements and substantial on-chip RAM.
• I/O-rich system interfaces — Connect multiple external peripherals and high-pin-count interfaces using up to 300 I/O pins.
• Memory-centric buffering and data handling — Use the approximately 4.98 Mbits of embedded memory for buffering, packet processing or FIFO implementations inside the FPGA fabric.

Unique Advantages

• High logic density: 65,600 logic elements provide headroom for complex designs and custom hardware acceleration.
• Substantial on-chip RAM: Approximately 4.98 Mbits of embedded memory reduces external memory dependency for many buffering and storage needs.
• Broad I/O count: Up to 300 I/Os allow flexible interfacing with sensors, peripherals and external logic.
• Compact, assembly-friendly package: 676-FCBGA (27x27) surface-mount package supports high-density board layouts and automated assembly.
• Extended-grade operation: Rated for 0 °C to 100 °C operation to meet a range of temperature requirements.
• RoHS compliant: Supports lead-free manufacturing and regulatory compliance for environmental standards.

Why Choose XC7K70T-3FBG676E?

The XC7K70T-3FBG676E positions itself as a mid-to-high density Kintex®-7 FPGA that balances logic capacity, embedded memory and a high I/O count in a compact FCBGA package. Its extended-grade rating and RoHS compliance make it suitable for applications that require reliable on-chip resources and a surface-mount form factor.

This device is a practical choice for engineers and designers who need substantial programmable logic and memory on a single device while maintaining a high pin count and a compact package from a recognized FPGA family by AMD.

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