XC7S100-1FGGA484C

IC FPGA 338 I/O 484FBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 338 4423680 102400 484-BGA

Quantity 519 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeCommercialOperating Temperature0°C – 85°C
Package / Case484-BGANumber of I/O338Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN5A002A1HTS Code8542.39.0001
QualificationN/ATotal RAM Bits4423680

Overview of XC7S100-1FGGA484C – Spartan®-7 Field Programmable Gate Array (FPGA) IC, 102,400 logic elements, ~4.42 Mbits RAM, 338 I/Os, 484-BGA

The XC7S100-1FGGA484C is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides on-chip programmable logic resources and embedded memory in a compact 484-ball BGA package.

With 102,400 logic elements, approximately 4.42 Mbits of embedded memory, and 338 I/O pins, this commercial-grade device is specified for surface-mount applications operating within a 0 °C to 85 °C temperature range and a core voltage range of 0.95 V to 1.05 V.

Key Features

  • Core Logic  102,400 logic elements for implementing programmable logic and custom datapaths.
  • Embedded Memory  Approximately 4.42 Mbits of on-chip RAM to support data buffering and state storage.
  • I/O Density  338 I/O pins to accommodate wide parallel interfaces and multiple external connections.
  • Power  Core voltage supply specified from 0.95 V to 1.05 V for compatibility with low-voltage system domains.
  • Package  484-BGA package (supplier device package: 484-FPBGA (23x23)) for a high-pin-count, compact footprint.
  • Mounting & Grade  Surface mount device specified at commercial grade.
  • Operating Temperature  Rated for operation from 0 °C to 85 °C.
  • Environmental Compliance  RoHS compliant.

Typical Applications

  • Commercial Embedded Systems  Use the FPGA's programmable logic and embedded memory to implement custom control and processing functions within commercial-temperature designs.
  • I/O-Intensive Interfaces  Leverage 338 I/Os for designs requiring multiple parallel or serial connections to external devices and sensors.
  • On-Chip Data Handling  Utilize approximately 4.42 Mbits of embedded RAM for buffering, packet handling, or temporary data storage in system designs.

Unique Advantages

  • Significant Logic Capacity: 102,400 logic elements enable sizeable custom logic implementations without supplemental external logic.
  • Substantial Embedded Memory: Approximately 4.42 Mbits of on-chip RAM reduces dependency on external memory for many buffering and state-storage tasks.
  • High I/O Count: 338 I/Os support complex connectivity requirements and simplify board-level routing for multi-interface designs.
  • Compact High-Pin Package: 484-BGA (484-FPBGA, 23×23) offers a dense, compact footprint for space-constrained applications.
  • Commercial Temperature Rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
  • RoHS Compliant: Meets environmental restriction requirements for lead-free assembly processes.

Why Choose XC7S100-1FGGA484C?

The XC7S100-1FGGA484C positions itself as a commercial-grade Spartan‑7 FPGA with a balance of programmable logic, embedded memory, and I/O capacity. Its specification set is appropriate for designers who need substantial on-chip resources and a high I/O count in a compact 484-BGA package.

Backed by AMD's Spartan‑7 family heritage, the device offers a clear, specification-driven choice for teams building reconfigurable logic into surface-mount, commercial-temperature systems while maintaining RoHS compliance.

Request a quote or submit a product inquiry to receive pricing and availability information for the XC7S100-1FGGA484C.

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