XC7S100-1FGGA676C

The XC7S100-1FGGA676C is a Spartan®-7 Field Programmable Gate Array (FPGA) IC from AMD designed for commercial-grade applications. It combines a substantial logic capacity with on-chip memory and a high pin count in a compact 676-ball BGA package to address mid-range programmable-logic requirements.

Key capabilities include approximately 102,400 logic elements, roughly 4.42 Mbits of embedded RAM, up to 400 I/O pins, and a low-voltage core supply range. The device is supplied in a 676-FPBGA (27×27) surface-mount package and specified for operation from 0 °C to 85 °C.

Key Features

• Core Logic  Approximately 102,400 logic elements for implementing combinational and sequential logic functions across a wide range of commercial designs.
• Embedded Memory  Approximately 4.42 Mbits of on-chip RAM provides local storage for buffers, FIFOs, and algorithm state without external memory in many designs.
• I/O Density  Up to 400 I/O pins enable support for numerous parallel interfaces, sensor arrays, or mixed-signal front-ends requiring many external connections.
• Power Supply  Core voltage specified from 0.95 V to 1.05 V to support low-voltage system architectures and predictable power design.
• Package & Mounting  Delivered in a 676-FPBGA (27×27) surface-mount package (676-BGA), providing a compact, high-density footprint for space-constrained PCBs.
• Operating Range  Commercial operating temperature range of 0 °C to 85 °C suitable for standard commercial applications.
• Regulatory Compliance  RoHS compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Commercial embedded systems  Use as the programmable logic core for mid-range embedded platforms where sizable logic capacity and on-chip memory reduce external component count.
• I/O-dense interface modules  Ideal for modules that require many parallel or mixed I/O connections, leveraging up to 400 I/Os for camera, display, or sensor aggregation.
• Memory-intensive processing  On-chip RAM supports local buffering and intermediate storage for algorithms that benefit from fast, embedded memory access.
• Evaluation and prototyping  A compact BGA package and commercial-grade specification make the device suitable for development boards and proof-of-concept hardware.

Unique Advantages

• High logic capacity: Approximately 102,400 logic elements let you implement complex logic blocks and parallel functions without immediate partitioning.
• Substantial embedded memory: Around 4.42 Mbits of on-chip RAM reduces reliance on external memory for many buffering and storage needs.
• Large I/O count: Up to 400 I/Os simplifies integration of multiple peripherals and parallel interfaces, minimizing external multiplexing.
• Compact, high-density package: The 676-FPBGA (27×27) surface-mount package balances pin count and PCB area for compact system designs.
• Low-voltage core operation: Core supply range of 0.95 V to 1.05 V supports power-sensitive architectures and predictable power budgeting.
• Commercial-grade suitability: Rated for 0 °C to 85 °C operation and RoHS compliant for standard commercial product deployments.

Why Choose XC7S100-1FGGA676C?

The XC7S100-1FGGA676C positions itself as a capable commercial-grade FPGA for designs that require a balance of logic density, embedded memory, and a high I/O count in a compact BGA footprint. Its combination of approximately 102,400 logic elements, about 4.42 Mbits of on-chip RAM, and up to 400 I/Os addresses a wide range of mid-range programmable logic needs while keeping PCB area and component count under control.

Manufactured by AMD and delivered in a 676-FPBGA surface-mount package with RoHS compliance, this device is intended for engineering teams developing commercial embedded systems, I/O-heavy modules, memory-dependent processing tasks, and prototype platforms that demand predictable electrical and thermal characteristics.

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