XC7S100-2FGGA676C

The XC7S100-2FGGA676C is an AMD Spartan®-7 field programmable gate array (FPGA) supplied in a 676-BGA package. It provides a substantial on-chip resource set, including 102,400 logic elements and approximately 4.42 Mbits of embedded memory, plus a high I/O count for complex interfaces.

Designed for commercial-grade applications, this surface-mount FPGA combines a large logic fabric and memory capacity with a 400-pin I/O footprint and a compact 676-FPBGA (27 × 27 mm) package, enabling high-density digital designs that require significant programmable logic and connectivity.

Key Features

• Core Logic  Approximately 102,400 logic elements and 8,000 CLBs provide a large programmable fabric for complex digital functions and state machines.
• Embedded Memory  Approximately 4.42 Mbits of on-chip RAM to support data buffering, FIFOs, and local storage for compute tasks.
• I/O Capacity  400 I/O pins to support multiple parallel interfaces, high-pin-count connectors, or dense sensor and bus connectivity.
• Power Supply  Core supply range 0.95 V to 1.05 V to match system power rails and support defined operating conditions.
• Package & Mounting  676-BGA (supplier package: 676-FPBGA, 27 × 27 mm) in a surface-mount form factor for compact board layouts and high-density assemblies.
• Operating Conditions  Commercial temperature grade with an operating range of 0 °C to 85 °C.
• Compliance  RoHS-compliant to meet common environmental and manufacturing requirements.

Typical Applications

• Embedded Systems  Implement control logic, custom peripherals, and system glue using the large logic fabric and abundant I/O.
• High-Density I/O Interfaces  Aggregate and bridge multiple parallel or serial interfaces where a 400-pin I/O count enables flexible connectivity.
• Data Buffering and Local Processing  Use the on-chip RAM to buffer streams, implement FIFOs, or perform local data manipulation close to your logic.
• Prototyping and Development Platforms  Leverage the programmable resources for proof-of-concept designs and iterative hardware development.

Unique Advantages

• High programmable density: 102,400 logic elements enable complex finite-state machines, wide datapaths, and sizable custom processors within a single device.
• Substantial embedded memory: Approximately 4.42 Mbits of on-chip RAM reduces external memory needs for many buffering and processing tasks.
• Large I/O count: 400 I/O pins provide the connectivity required for multi-channel systems and dense interface routing.
• Compact, board-friendly package: 676-FPBGA (27 × 27 mm) balances high pin count with a small PCB footprint for space-constrained designs.
• Commercial-grade operating range: Rated 0 °C to 85 °C for typical commercial deployments.
• RoHS compliance: Meets common manufacturing and environmental standards for many product lines.

Why Choose XC7S100-2FGGA676C?

The XC7S100-2FGGA676C positions itself as a capable, commercially graded FPGA option for designs that need a large logic fabric, significant on-chip memory, and a high I/O count in a compact BGA package. Its combination of 102,400 logic elements, approximately 4.42 Mbits of embedded RAM, and 400 I/Os makes it suitable for systems that integrate substantial custom logic and dense connectivity within constrained board space.

Manufactured by AMD and supplied in a surface-mount 676-FPBGA package, this device is appropriate for engineering teams seeking a scalable, programmable solution that aligns with common commercial temperature and environmental requirements.

Request a quote or submit an inquiry to get pricing and availability for the XC7S100-2FGGA676C and to discuss volume options or lead times.