XC7S100-L1FGGA676I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 400 4423680 102400 676-BGA |
|---|---|
| Quantity | 69 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 676-FPBGA (27x27) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 676-BGA | Number of I/O | 400 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8000 | Number of Logic Elements/Cells | 102400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4423680 |
Overview of XC7S100-L1FGGA676I – Spartan®-7 Field Programmable Gate Array (FPGA) IC 400 4423680 102400 676-BGA
The XC7S100-L1FGGA676I is a Spartan®-7 Field Programmable Gate Array (FPGA) from AMD. It provides 102,400 logic elements, approximately 4.4 Mbits of embedded memory, and 400 I/O in a 676-FPBGA (27×27) package.
Built for industrial-grade operation, this surface-mount FPGA supports a core supply range of 920 mV to 980 mV and an operating temperature range of -40°C to 100°C. The device is RoHS compliant and supplied in a 676-BGA package.
Key Features
- Core Logic Capacity 102,400 logic elements provide substantial programmable logic for medium-complexity designs.
- Embedded Memory Approximately 4.4 Mbits of on-chip RAM to support buffering, state machines, and on-chip data storage.
- I/O 400 user I/O pins to accommodate multiple parallel interfaces and signal domains.
- Power Core supply voltage specified between 920 mV and 980 mV for low-voltage operation.
- Package 676-FPBGA (27×27) package (676-BGA footprint) for a compact, high-pin-count implementation.
- Mounting & Compliance Surface-mount device with RoHS compliance for standard industrial assembly processes.
- Operating Temperature Rated for industrial temperature range of -40°C to 100°C.
Unique Advantages
- High logic density: 102,400 logic elements enable implementation of sizeable custom logic blocks without external PLD components.
- Significant on-chip memory: Approximately 4.4 Mbits of embedded RAM reduce dependence on external memory for many designs.
- Extensive I/O availability: 400 I/O pins allow flexible interfacing with multiple peripherals and sensors.
- Industrial-grade thermal range: -40°C to 100°C rating supports deployment in challenging temperature environments.
- Compact BGA footprint: 676-FPBGA (27×27) balances pin count and board area for space-constrained systems.
- Low-voltage core operation: 920–980 mV supply range supports low-power core designs.
Why Choose XC7S100-L1FGGA676I?
The XC7S100-L1FGGA676I combines substantial programmable logic, on-chip memory, and a high I/O count in a compact 676-FPBGA package, making it well suited for industrial applications that require reconfigurable digital logic and robust thermal performance. Its specified core voltage range and RoHS compliance align with modern low-voltage and regulated manufacturing requirements.
As an industrial-grade Spartan®-7 FPGA from AMD, this device is appropriate for engineers seeking a balance of integration, I/O capacity, and temperature robustness for medium-complexity FPGA designs.
Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XC7S100-L1FGGA676I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








