XC7S100-L1FGGA676I

IC FPGA 400 I/O 676FPBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 400 4423680 102400 676-BGA

Quantity 69 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FPBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BGANumber of I/O400Voltage920 mV - 980 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4423680

Overview of XC7S100-L1FGGA676I – Spartan®-7 Field Programmable Gate Array (FPGA) IC 400 4423680 102400 676-BGA

The XC7S100-L1FGGA676I is a Spartan®-7 Field Programmable Gate Array (FPGA) from AMD. It provides 102,400 logic elements, approximately 4.4 Mbits of embedded memory, and 400 I/O in a 676-FPBGA (27×27) package.

Built for industrial-grade operation, this surface-mount FPGA supports a core supply range of 920 mV to 980 mV and an operating temperature range of -40°C to 100°C. The device is RoHS compliant and supplied in a 676-BGA package.

Key Features

  • Core Logic Capacity 102,400 logic elements provide substantial programmable logic for medium-complexity designs.
  • Embedded Memory Approximately 4.4 Mbits of on-chip RAM to support buffering, state machines, and on-chip data storage.
  • I/O 400 user I/O pins to accommodate multiple parallel interfaces and signal domains.
  • Power Core supply voltage specified between 920 mV and 980 mV for low-voltage operation.
  • Package 676-FPBGA (27×27) package (676-BGA footprint) for a compact, high-pin-count implementation.
  • Mounting & Compliance Surface-mount device with RoHS compliance for standard industrial assembly processes.
  • Operating Temperature Rated for industrial temperature range of -40°C to 100°C.

Unique Advantages

  • High logic density: 102,400 logic elements enable implementation of sizeable custom logic blocks without external PLD components.
  • Significant on-chip memory: Approximately 4.4 Mbits of embedded RAM reduce dependence on external memory for many designs.
  • Extensive I/O availability: 400 I/O pins allow flexible interfacing with multiple peripherals and sensors.
  • Industrial-grade thermal range: -40°C to 100°C rating supports deployment in challenging temperature environments.
  • Compact BGA footprint: 676-FPBGA (27×27) balances pin count and board area for space-constrained systems.
  • Low-voltage core operation: 920–980 mV supply range supports low-power core designs.

Why Choose XC7S100-L1FGGA676I?

The XC7S100-L1FGGA676I combines substantial programmable logic, on-chip memory, and a high I/O count in a compact 676-FPBGA package, making it well suited for industrial applications that require reconfigurable digital logic and robust thermal performance. Its specified core voltage range and RoHS compliance align with modern low-voltage and regulated manufacturing requirements.

As an industrial-grade Spartan®-7 FPGA from AMD, this device is appropriate for engineers seeking a balance of integration, I/O capacity, and temperature robustness for medium-complexity FPGA designs.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XC7S100-L1FGGA676I.

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