XC7S100-2FGGA676I

The XC7S100-2FGGA676I is a Spartan®-7 field programmable gate array (FPGA) from AMD, packaged in a 676-ball BGA. It provides 102,400 logic elements, approximately 4.4 Mbits of on-chip RAM, and up to 400 I/O pins in a surface-mount 676-FPBGA (27×27) package.

Engineered for industrial applications, this device offers a compact integration of programmable logic, embedded memory, and a wide operating temperature range, enabling configurable I/O and logic functions where board-level flexibility and rugged thermal performance are required.

Key Features

• Logic Capacity  102,400 logic elements for implementing complex programmable logic and custom digital functions.
• Embedded Memory  Approximately 4.4 Mbits of on-chip RAM to support data buffering, FIFOs, and state storage without external memory.
• I/O Density  Up to 400 I/O pins to support multiple interfaces, parallel buses, and mixed-signal front-end connections.
• Package  676-BGA package (supplier device package: 676-FPBGA, 27×27) in a surface-mount form factor for high-density PCB designs.
• Power Supply Range  Core voltage range specified at 950 mV to 1.05 V to match target power domains and board-level supply considerations.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet thermal requirements of industrial environments.
• RoHS Compliant  Conforms to RoHS requirements for lead-free assembly and environmental compliance.

Typical Applications

• Industrial Control  Programmable logic for control systems and I/O aggregation that benefit from wide temperature range and industrial grading.
• Custom Interface Bridging  Implement protocol conversion and glue-logic using the device’s 400 I/O pins and substantial logic capacity.
• Data Buffering and Preprocessing  On-chip RAM supports buffering, FIFO management, and preprocessing tasks in embedded data-acquisition or signal-path systems.

Unique Advantages

• High Logic Density: 102,400 logic elements enable consolidation of multiple discrete functions into a single programmable device, reducing PCB component count.
• Significant On-Chip Memory: Approximately 4.4 Mbits of embedded RAM allows internal data handling and reduces dependence on external memory.
• Generous I/O Count: 400 available I/Os support complex interconnects and multi-interface designs without extensive external multiplexing.
• Industrial Reliability: Rated for −40 °C to 100 °C operation, suitable for deployments that require extended temperature performance.
• Compact, Surface-Mount Package: 676-FPBGA (27×27) provides high-pin-count connectivity in a space-efficient package for dense board layouts.
• Regulatory Compliance: RoHS compliance supports modern manufacturing and environmental requirements.

Why Choose XC7S100-2FGGA676I?

The XC7S100-2FGGA676I combines a Spartan®-7 FPGA architecture with 102,400 logic elements, substantial embedded RAM, and up to 400 I/O in a compact 676-BGA package. Its specified core supply range and industrial temperature rating make it a practical choice for industrial embedded designs that require programmable logic, flexible I/O routing, and on-chip memory within a surface-mount form factor.

This part is well suited to engineers and product teams seeking a scalable, field-programmable solution for control, interfacing, and data-preprocessing tasks where board-level integration and thermal robustness are key selection criteria.

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