XC7S100-1FGGA676I

The XC7S100-1FGGA676I is a Spartan®-7 field programmable gate array (FPGA) from AMD, supplied in a 676-ball BGA package. It provides a balance of programmable logic, embedded memory, and high-density I/O targeted for industrial-grade applications.

Designed for deployments that require mid-range logic capacity with robust operating conditions, this device is suitable for designs where thermal range, I/O count and on-chip memory are key selection factors.

Key Features

• Logic Capacity — 102,400 logic elements provide the programmable fabric needed for complex custom logic and mid-range FPGA designs.
• Embedded Memory — Approximately 4.42 Mbits of on-chip RAM (4,423,680 bits) for buffering, lookup tables, and local data storage.
• I/O Density — 400 user I/Os to support multiple interfaces, signal aggregations, and dense connectivity requirements.
• Power — Core voltage supply range of 950 mV to 1.05 V to match standard FPGA power rails and enable predictable power budgeting.
• Package & Assembly — 676-BGA package (supplier device package: 676-FPBGA (27x27)) with surface-mount mounting type for compact, board-level integration.
• Industrial Temperature — Rated for operation from -40 °C to 100 °C, suitable for thermally demanding environments.
• Compliance — RoHS compliant to support regulatory environmental requirements.

Typical Applications

• Industrial Control — Use in programmable logic for industrial automation and control systems where the industrial temperature rating ensures reliable operation across harsh environments.
• High-Density I/O Systems — Aggregating sensors, actuators, and multiple digital interfaces using the device’s 400 I/O pins for complex system integration.
• Memory-Dependent Logic — Implement local buffering, FIFO structures, and table-driven logic utilizing approximately 4.42 Mbits of embedded RAM.
• Embedded and Edge Processing — Mid-range logic capacity (102,400 logic elements) supports custom processing blocks and application-specific accelerators in embedded systems.

Unique Advantages

• Balanced Logic and Memory: 102,400 logic elements paired with approximately 4.42 Mbits of RAM let you implement substantial custom logic and local data storage without external memory.
• High I/O Count: 400 I/Os simplify routing of multiple interfaces and reduce the need for external I/O expanders.
• Industrial Temperature Range: Rated -40 °C to 100 °C to support deployment in temperature-challenging environments.
• Compact, Surface-Mount Package: 676-FPBGA (27x27) enables dense board layouts while supporting robust board-level assembly processes.
• Controlled Power Envelope: Core voltage range of 950 mV to 1.05 V helps designers budget power and design appropriate supply rails.
• Environmental Compliance: RoHS compliance supports environmentally responsible product designs and procurement.

Why Choose XC7S100-1FGGA676I?

The XC7S100-1FGGA676I delivers a practical combination of mid-range logic density, meaningful on-chip memory, and a high I/O count in a compact 676-BGA package, all rated for industrial temperature operation. Its specification set is well suited to engineers building industrial and embedded systems that require reliable, board-level integration.

As part of the Spartan®-7 family from AMD, this device provides a predictable foundation for designs that prioritize scalable programmable logic, dense connectivity, and operation across extended temperature ranges.

Request a quote or submit an inquiry for XC7S100-1FGGA676I to obtain pricing and availability information for your next design.