XC7S100-1FGGA484Q

IC FPGA 338 I/O 484FBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 338 4423680 102400 484-BGA

Quantity 673 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeAutomotiveOperating Temperature-40°C – 125°C
Package / Case484-BGANumber of I/O338Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationAEC-Q100Total RAM Bits4423680

Overview of XC7S100-1FGGA484Q – Spartan®-7 FPGA, 484‑BGA

The XC7S100-1FGGA484Q is a Spartan®-7 field programmable gate array (FPGA) in a 484-ball BGA package designed for applications requiring substantial logic, embedded memory and high I/O density. It provides 102,400 logic elements and approximately 4.42 Mbits of embedded memory, enabling complex programmable logic implementations in a compact surface-mount package.

With a core supply range of 950 mV to 1.05 V and an operating temperature range of −40 °C to 125 °C, this device is offered in an automotive-grade variant qualified to AEC‑Q100 for use in demanding temperature environments.

Key Features

  • Core Logic — 102,400 logic elements to implement large-scale programmable logic and custom digital functions.
  • Embedded Memory — Approximately 4.42 Mbits (4,423,680 bits) of on-chip RAM for buffering, storage and state processing without external memory.
  • I/O Density — 338 user I/O pins to support multiple interfaces, parallel buses and high-pin-count peripherals.
  • Power — Core voltage supply range from 950 mV to 1.05 V to match system power rails and low-voltage domains.
  • Package & Mounting — 484‑BGA package (supplier package: 484‑FPBGA, 23×23 mm) in a surface-mount form factor for compact board layouts.
  • Temperature & Qualification — Operating range −40 °C to 125 °C and Automotive grade with AEC‑Q100 qualification for demanding environmental conditions.
  • Compliance — RoHS compliant for reduced environmental impact during manufacturing and assembly.

Unique Advantages

  • High logic capacity: 102,400 logic elements provide headroom for complex state machines, data paths and programmable accelerators.
  • Substantial on-chip memory: Approximately 4.42 Mbits of embedded RAM reduces reliance on external memory and simplifies BOM.
  • High I/O count: 338 I/O pins support dense peripheral integration and multiple simultaneous interfaces.
  • Automotive-grade qualification: AEC‑Q100 qualification and extended temperature range support deployment in temperature-stressed environments.
  • Compact BGA footprint: 484‑BGA (23×23 mm) enables space-efficient board designs while retaining large logic and memory resources.
  • Low-voltage core operation: 950 mV–1.05 V core supply aligns with modern low-voltage power domains for efficient system integration.

Why Choose XC7S100-1FGGA484Q?

The XC7S100-1FGGA484Q positions itself for designs that require a balance of high logic density, significant embedded memory and a large number of I/O in a compact surface-mount package. Its automotive-grade qualification (AEC‑Q100) and wide operating temperature range make it suitable for applications that demand robust thermal performance.

Choose this Spartan®-7 FPGA when your project requires substantial programmable logic resources, on-chip RAM to reduce external components, and a high I/O count while maintaining a compact BGA footprint and compliance with RoHS and automotive qualification standards.

Request a quote or submit an inquiry to receive pricing and availability for the XC7S100-1FGGA484Q.

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