XC7S100-1FGGA484I

The XC7S100-1FGGA484I is an AMD Spartan®-7 field programmable gate array (FPGA) supplied in a 484-ball BGA package. It provides a balanced combination of programmable logic, embedded memory, and a high count of I/O for designs that require sizable on-chip resources in a compact surface-mount package.

Key on-chip resources include approximately 102,400 logic elements, roughly 4.4 Mbits of embedded memory, and 338 I/O pins. The device operates from a core voltage range of 0.95 V to 1.05 V and is specified for industrial temperature operation from -40 °C to 100 °C.

Key Features

• Logic resources — Approximately 102,400 logic elements implemented across 8,000 configurable logic blocks (CLBs) to support complex digital designs and moderate-level integration.
• Embedded memory — Approximately 4.4 Mbits of on-chip RAM for buffering, packet storage, state machines, and other memory-hungry functions.
• I/O capacity — 338 user I/O pins to support multiple interfaces, peripherals, and signal domains within a single device.
• Power — Core supply voltage specified from 0.95 V to 1.05 V, enabling defined core power planning and regulation for system designs.
• Package and mounting — 484-ball BGA (484-FPBGA, 23 × 23) surface-mount package that supports compact PCB layouts and high-density board integration.
• Industrial temperature range — Rated for operation from -40 °C to 100 °C for deployment in temperature-challenging environments.
• Regulatory compliance — RoHS compliant to support environmentally conscious manufacturing requirements.

Unique Advantages

• High integration density: The combination of ~102,400 logic elements and ~4.4 Mbits of embedded memory enables consolidation of multiple functions into a single FPGA, reducing BOM and board complexity.
• Generous I/O pin count: With 338 I/O pins, the device supports multiple external interfaces and parallel connectivity without immediate need for external multiplexing.
• Compact BGA footprint: The 484-FPBGA (23×23) package delivers a high-pin-count solution in a space-efficient form factor suitable for dense PCB layouts.
• Industrial-grade thermal range: Specified operation from -40 °C to 100 °C helps ensure reliable behavior across a wide range of environmental conditions.
• Defined core voltage window: The 0.95 V–1.05 V supply range provides precise power planning for system designers targeting predictable performance and power budgets.
• RoHS compliant: Meets common environmental regulations for lead-free manufacturing processes.

Why Choose XC7S100-1FGGA484I?

The XC7S100-1FGGA484I is positioned for designs that require substantial on-chip logic and memory resources combined with a high I/O count, all in a compact BGA package rated for industrial temperatures. Its specification set supports engineers focused on consolidating functionality, simplifying board-level routing, and maintaining predictable power and thermal characteristics.

This device is suitable for customers seeking a programmable, RoHS-compliant FPGA with approximately 102,400 logic elements, roughly 4.4 Mbits of embedded memory, and up to 338 I/O pins—offering long-term value through integration and predictable environmental performance.

If you would like pricing or availability information, request a quote or submit an inquiry to receive a formal quotation and lead-time details.