XC7S100-2FGGA484C

The XC7S100-2FGGA484C is a Spartan®-7 Field Programmable Gate Array (FPGA) manufactured by AMD. It provides a reprogrammable logic fabric in a compact 484-ball BGA package suitable for commercial-grade applications.

With high-density logic resources, embedded memory, and a substantial I/O count, this device is intended for designers implementing configurable digital logic, prototyping, and custom interfacing in systems that operate within commercial temperature and voltage ranges.

Key Features

• Core Logic  Approximately 102,400 logic elements organized across 8,000 configurable logic blocks (CLBs), enabling substantial programmable logic capacity.
• Embedded Memory  Approximately 4.42 Mbits of on-chip RAM to support buffering, small data storage, and local state for implemented functions.
• I/O Resources  338 user I/O pins to support multiple parallel interfaces and signal routing in dense designs.
• Power  Core supply range of 950 mV to 1.05 V to match low-voltage FPGA power domains.
• Package & Mounting  484-ball BGA (supplier package: 484-FPBGA, 23×23) in a surface-mount form factor for compact PCB layouts.
• Operating Range & Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for regulatory alignment.

Typical Applications

• Prototyping and Development  Use the Spartan‑7 FPGA fabric to implement and iterate custom digital logic and validate system-level designs.
• Custom Interface Bridging  Leverage the device's large I/O count to create protocol translators and interface glue logic between subsystems.
• Embedded Logic Acceleration  Deploy programmable logic to offload and accelerate deterministic, application-specific tasks within commercial electronic products.

Unique Advantages

• High Logic Density:  Approximately 102,400 logic elements and 8,000 CLBs provide the capacity to implement complex state machines and custom datapaths.
• Substantial On‑Chip Memory:  Roughly 4.42 Mbits of embedded RAM reduces dependence on external memory for many buffering and local storage needs.
• Extensive I/O:  338 I/O pins enable flexible interfacing to sensors, peripherals, and parallel buses without extensive board-level multiplexing.
• Compact, Surface‑Mount Package:  484-FPBGA (23×23) delivers a small PCB footprint for space-constrained applications while maintaining high interconnect density.
• Commercial‑Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS compliant for typical commercial deployments.
• Low‑Voltage Core:  Core supply range of 950 mV to 1.05 V aligns with modern low-voltage designs to help manage power budgets.

Why Choose XC7S100-2FGGA484C?

The XC7S100-2FGGA484C combines a sizable logic fabric, meaningful on-chip RAM, and a broad I/O complement in a compact 484-BGA package, making it a practical choice for commercial projects that require configurable digital logic and dense interfacing. Its commercial temperature range and RoHS compliance support deployment in a wide range of electronic products.

This device is well suited to designers who need a balance of logic capacity, embedded memory, and I/O availability in a surface-mount form factor, providing a scalable option for prototyping and production of custom digital subsystems.

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