XC7S100-L1FGGA484I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 338 4423680 102400 484-BGA |
|---|---|
| Quantity | 304 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 338 | Voltage | 920 mV - 980 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8000 | Number of Logic Elements/Cells | 102400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4423680 |
Overview of XC7S100-L1FGGA484I – Spartan®-7 Field Programmable Gate Array (FPGA) IC 338 4423680 102400 484-BGA
The XC7S100-L1FGGA484I is an AMD Spartan®-7 FPGA offering a high-density programmable logic fabric with 102,400 logic elements and approximately 4.42 Mbits of embedded memory. It provides a balance of logic capacity, on-chip RAM and a large I/O complement for system-level integration.
Designed for industrial-grade applications, this device supports a core supply range of 920 mV to 980 mV and an operating temperature range of −40 °C to 100 °C, packaged in a compact 484-BGA surface-mount footprint.
Key Features
- Core Logic — 102,400 logic elements deliver substantial programmable logic capacity for implementing custom digital functions and state machines.
- Embedded Memory — Approximately 4.42 Mbits of on-chip RAM to support buffering, LUT-based storage and local data working sets without external memory.
- I/O Density — 338 general-purpose I/Os enable complex interface integration and multi-channel connectivity on a single device.
- Power — Core voltage supply range of 920 mV to 980 mV for predictable core-level power planning.
- Package & Mounting — 484-BGA (supplier package: 484-FPBGA, 23 × 23 mm) in a surface-mount form factor for compact board designs.
- Temperature & Grade — Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance — RoHS compliant.
Typical Applications
- Industrial control systems — Implement custom control logic, protocol handling and interface glue in automation and factory equipment while meeting industrial temperature requirements.
- Embedded processing and prototyping — Develop and validate custom digital functions and accelerators that benefit from programmable logic and on-chip RAM.
- High-density I/O bridging — Consolidate multiple interfaces and signal conversions using the device’s large I/O count to simplify board-level design.
Unique Advantages
- High logic capacity: 102,400 logic elements support sizable custom logic implementations without partitioning across multiple devices.
- Substantial on-chip memory: Approximately 4.42 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
- Extensive I/O: 338 I/Os allow integration of numerous peripherals and interfaces on a single FPGA.
- Industrial robustness: Rated for −40 °C to 100 °C operation, suitable for harsh and temperature-variable environments.
- Compact BGA footprint: 484-BGA, 23 × 23 mm package minimizes PCB area while providing a high pin count.
- predictable core supply: Narrow core voltage range (920 mV–980 mV) simplifies power-supply design and verification.
Why Choose XC7S100-L1FGGA484I?
The XC7S100-L1FGGA484I combines a large logic fabric, meaningful on-chip RAM and a high I/O count in an industrial-grade Spartan‑7 device. Its package and supply characteristics make it suitable for designs that require condensed board area, significant programmable logic, and robust environmental tolerance.
Engineers designing industrial and embedded systems will find this device appropriate for consolidating interfaces, implementing custom processing blocks and reducing external component count while maintaining predictable power and thermal characteristics.
Request a quote or submit an RFQ today to get pricing and availability for the XC7S100-L1FGGA484I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








