XC7S100-2FGGA484I

IC FPGA 338 I/O 484FBGA
Part Description

Spartan®-7 Field Programmable Gate Array (FPGA) IC 338 4423680 102400 484-BGA

Quantity 695 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FPBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BGANumber of I/O338Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs8000Number of Logic Elements/Cells102400
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits4423680

Overview of XC7S100-2FGGA484I – Spartan®-7 FPGA, 102,400 logic elements, 338 I/O, 484-BGA

The XC7S100-2FGGA484I is a Spartan®-7 Field Programmable Gate Array (FPGA) designed for reconfigurable digital logic in embedded and industrial applications. It provides a balance of logic capacity, on-chip memory, and I/O density in a compact 484-BGA package for surface-mount assembly.

With 102,400 logic elements and approximately 4.4 Mbits of embedded memory, this device supports complex logic designs while operating across a core supply range of 0.95 V to 1.05 V and an industrial temperature range of –40 °C to 100 °C.

Key Features

  • Logic Capacity  Provides 102,400 logic elements suitable for mid-sized programmable logic designs and complex state machines.
  • Embedded Memory  Approximately 4.4 Mbits of on-chip RAM to support buffering, lookup tables, and local storage without external memory.
  • I/O Density  338 input/output pins for flexible interfacing to peripherals, sensors, and external devices.
  • Power Supply  Core voltage supply range of 0.95 V to 1.05 V, enabling predictable power domain planning in system designs.
  • Package and Mounting  484-BGA footprint (supplier package: 484-FPBGA, 23×23) in a surface-mount format for compact board integration.
  • Industrial Temperature Range  Rated for operation from –40 °C to 100 °C to meet temperature demands in industrial environments.
  • Regulatory Compliance  RoHS compliant to support lead-free assembly processes and environmental requirements.

Typical Applications

  • Industrial Control  Implement deterministic control logic, sensor interfacing, and custom communication endpoints while meeting industrial temperature requirements.
  • Embedded Systems  Provide application-specific hardware acceleration and glue logic for mid-range embedded platforms using abundant logic and on-chip memory.
  • I/O-Intensive Designs  Support boards requiring many external interfaces or parallel I/O with 338 available I/O pins.
  • Prototyping and Proof-of-Concept  Enable rapid hardware iteration for complex digital designs with reconfigurable logic and on-chip RAM.

Unique Advantages

  • Substantial Logic Resources: 102,400 logic elements provide headroom for complex finite-state machines, data-path logic, and custom accelerators.
  • Local Memory Capacity: Approximately 4.4 Mbits of embedded RAM reduces dependency on external memory for buffering and lookup operations.
  • High I/O Count: 338 I/O pins allow direct connection to multiple peripherals and parallel interfaces, simplifying board-level routing.
  • Industrial Robustness: Operation from –40 °C to 100 °C supports deployments in temperature-challenging environments.
  • Compact, Surface-Mount Package: 484-BGA (484-FPBGA, 23×23) enables high-density PCB designs while maintaining manufacturability.
  • RoHS Compliance: Conforms to lead-free assembly processes for regulatory and environmental compatibility.

Why Choose XC7S100-2FGGA484I?

The XC7S100-2FGGA484I positions itself as a practical choice for engineers who need a mid-range Spartan®-7 FPGA with significant logic resources, embedded memory, and plentiful I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life embedded and industrial projects that require reliable operation across temperature extremes.

This FPGA is well suited for teams building reconfigurable hardware where on-chip memory, high I/O counts, and compact packaging reduce board-level complexity and accelerate time to market while maintaining predictable power and thermal parameters.

Request a quote or submit a pricing inquiry today to check availability and obtain lead-time and pricing details for the XC7S100-2FGGA484I.

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