XC7S100-2FGGA484I
| Part Description |
Spartan®-7 Field Programmable Gate Array (FPGA) IC 338 4423680 102400 484-BGA |
|---|---|
| Quantity | 695 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FPBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BGA | Number of I/O | 338 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 8000 | Number of Logic Elements/Cells | 102400 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4423680 |
Overview of XC7S100-2FGGA484I – Spartan®-7 FPGA, 102,400 logic elements, 338 I/O, 484-BGA
The XC7S100-2FGGA484I is a Spartan®-7 Field Programmable Gate Array (FPGA) designed for reconfigurable digital logic in embedded and industrial applications. It provides a balance of logic capacity, on-chip memory, and I/O density in a compact 484-BGA package for surface-mount assembly.
With 102,400 logic elements and approximately 4.4 Mbits of embedded memory, this device supports complex logic designs while operating across a core supply range of 0.95 V to 1.05 V and an industrial temperature range of –40 °C to 100 °C.
Key Features
- Logic Capacity Provides 102,400 logic elements suitable for mid-sized programmable logic designs and complex state machines.
- Embedded Memory Approximately 4.4 Mbits of on-chip RAM to support buffering, lookup tables, and local storage without external memory.
- I/O Density 338 input/output pins for flexible interfacing to peripherals, sensors, and external devices.
- Power Supply Core voltage supply range of 0.95 V to 1.05 V, enabling predictable power domain planning in system designs.
- Package and Mounting 484-BGA footprint (supplier package: 484-FPBGA, 23×23) in a surface-mount format for compact board integration.
- Industrial Temperature Range Rated for operation from –40 °C to 100 °C to meet temperature demands in industrial environments.
- Regulatory Compliance RoHS compliant to support lead-free assembly processes and environmental requirements.
Typical Applications
- Industrial Control Implement deterministic control logic, sensor interfacing, and custom communication endpoints while meeting industrial temperature requirements.
- Embedded Systems Provide application-specific hardware acceleration and glue logic for mid-range embedded platforms using abundant logic and on-chip memory.
- I/O-Intensive Designs Support boards requiring many external interfaces or parallel I/O with 338 available I/O pins.
- Prototyping and Proof-of-Concept Enable rapid hardware iteration for complex digital designs with reconfigurable logic and on-chip RAM.
Unique Advantages
- Substantial Logic Resources: 102,400 logic elements provide headroom for complex finite-state machines, data-path logic, and custom accelerators.
- Local Memory Capacity: Approximately 4.4 Mbits of embedded RAM reduces dependency on external memory for buffering and lookup operations.
- High I/O Count: 338 I/O pins allow direct connection to multiple peripherals and parallel interfaces, simplifying board-level routing.
- Industrial Robustness: Operation from –40 °C to 100 °C supports deployments in temperature-challenging environments.
- Compact, Surface-Mount Package: 484-BGA (484-FPBGA, 23×23) enables high-density PCB designs while maintaining manufacturability.
- RoHS Compliance: Conforms to lead-free assembly processes for regulatory and environmental compatibility.
Why Choose XC7S100-2FGGA484I?
The XC7S100-2FGGA484I positions itself as a practical choice for engineers who need a mid-range Spartan®-7 FPGA with significant logic resources, embedded memory, and plentiful I/O in a compact BGA package. Its industrial temperature rating and RoHS compliance make it suitable for long-life embedded and industrial projects that require reliable operation across temperature extremes.
This FPGA is well suited for teams building reconfigurable hardware where on-chip memory, high I/O counts, and compact packaging reduce board-level complexity and accelerate time to market while maintaining predictable power and thermal parameters.
Request a quote or submit a pricing inquiry today to check availability and obtain lead-time and pricing details for the XC7S100-2FGGA484I.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








