XC7K70T-L2FBG676E

The XC7K70T-L2FBG676E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC offered in a 676-ball FCBGA package. It provides a balanced combination of programmable logic, on-chip RAM, and I/O resources suitable for a wide range of embedded digital designs.

With 65,600 logic elements, approximately 4.98 Mbits of embedded memory, and 300 user I/Os, this extended-grade device targets designs that require significant logic capacity, internal buffering, and a high I/O count in a compact surface-mount package.

Key Features

• Core Logic 65,600 logic elements provide substantial programmable logic resources for implementing custom digital functions and state machines.
• On‑Chip Memory Approximately 4.98 Mbits of embedded memory for data buffering, FIFOs, and small lookup tables within the FPGA fabric.
• I/O Capacity 300 user I/Os enable interfaces to multiple peripherals, buses, and external devices without external I/O expanders.
• Power Supply Range Core voltage support specified from 970 mV to 1.03 V to match system power-rail requirements for the device.
• Package & Mounting 676‑FBGA (27×27 mm) FCBGA package, surface-mount mounting for compact board-level integration.
• Temperature & Grade Extended-grade device with an operating temperature range of 0°C to 100°C suitable for a broad range of controlled-environment applications.
• Compliance RoHS compliant to support environmental and regulatory requirements for lead-free assembly.

Typical Applications

• Configurable digital logic — Implement custom processing pipelines, glue logic, and state machines using the device’s 65,600 logic elements.
• Embedded memory buffering — Use approximately 4.98 Mbits of on-chip RAM for packet buffering, FIFOs, and temporary storage close to logic.
• High-density I/O systems — Connect multiple external peripherals and buses directly to the FPGA using 300 available I/Os.

Unique Advantages

• High logic capacity: 65,600 logic elements accommodate complex logic implementations without immediate need for additional FPGAs.
• Substantial embedded memory: Approximately 4.98 Mbits of RAM reduces dependency on external memory for many buffering tasks.
• Extensive I/O count: 300 I/Os simplify board routing and lower bill-of-materials by reducing external interface components.
• Compact FCBGA package: 676-ball, 27×27 mm footprint enables dense PCB layouts while supporting surface-mount assembly.
• Extended operating range: 0°C to 100°C grade provides reliable operation across typical commercial and controlled-environment applications.
• RoHS compliant: Supports lead-free manufacturing processes and environmental compliance requirements.

Why Choose XC7K70T-L2FBG676E?

The XC7K70T-L2FBG676E delivers a balanced combination of logic density, embedded memory, and high I/O capacity within a compact 676-FCBGA package. Its extended-grade temperature rating and RoHS compliance make it a practical choice for designers who need substantial programmable resources without enlarging board real estate.

This device is well suited for projects that require on-chip memory for buffering, a high number of external interfaces, and significant programmable logic capacity—providing a scalable option within the Kintex®-7 family for medium- to high-complexity digital designs.

Request a quote or submit your procurement inquiry today to evaluate the XC7K70T-L2FBG676E for your next design.