XC7K70T-3FBG484E

The XC7K70T-3FBG484E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It provides programmable logic with 65,600 logic elements and approximately 4.98 Mbits of embedded memory in a 484-FCBGA package.

This device is offered in an extended-grade temperature range and is designed for surface-mount board-level integration where a high count of I/O and on-chip memory are required.

Key Features

• Core Logic 65,600 logic elements provide the programmable fabric for implementing custom digital functions.
• Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffering, LUT-based storage, and data processing tasks.
• I/O Capacity 285 user I/O pins to support a wide range of parallel and serial interfaces at the board level.
• Power Supply Core voltage range specified from 0.970 V to 1.03 V to match system power-rail requirements.
• Package & Mounting 484-FCBGA (23 × 23) package, surface-mount mounting type for compact board layouts.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C for demanding thermal environments.
• Environmental Compliance RoHS compliant.

Unique Advantages

• High logic capacity: 65,600 logic elements enable complex custom logic implementations without external programmable logic expansion.
• Substantial on-chip RAM: Approximately 4.98 Mbits of embedded memory reduces reliance on external memory for many buffering and state-storage needs.
• Generous I/O count: 285 I/O pins support multiple parallel interfaces and mixed-signal routing on the PCB.
• Compact ball-grid package: 484-FCBGA (23 × 23) minimizes board area while keeping a high pin count for dense system designs.
• Defined core-voltage window: Operates from 0.970 V to 1.03 V to align with system power-rail design and regulator selection.
• Extended temperature grade: Rated 0 °C to 100 °C for use in applications requiring wider-than-commercial thermal tolerance.

Why Choose XC7K70T-3FBG484E?

The XC7K70T-3FBG484E positions itself as a capable Kintex®-7 FPGA option for designs needing a balance of substantial logic resources, on-chip memory, and a high I/O count in a compact FCBGA package. Its specified core-voltage range and extended temperature grade make it suitable for systems where defined power rails and broader thermal operating windows are important.

This device is appropriate for engineers and procurement teams building board-level digital systems that require programmable logic density, integrated RAM capacity, and a surface-mount ball-grid package with RoHS compliance.

Request a quote or submit a pricing inquiry today to check availability, lead times, and tailored volume pricing for the XC7K70T-3FBG484E.