XC7K70T-2FBG676I

The XC7K70T-2FBG676I is a Kintex®-7 Field Programmable Gate Array (FPGA) IC designed for industrial-grade programmable-logic applications. It combines a large logic fabric with embedded RAM and a broad I/O count in a 676‑FCBGA package, supporting operation across a wide industrial temperature range.

Key Features

• Logic Capacity — Provides 65,600 logic elements suitable for complex programmable-logic implementations.
• Embedded Memory — Approximately 4.98 Mbits of on-chip RAM for buffering, state storage, and local data handling.
• I/O Density — 300 user I/Os to support multi-channel interfacing and high-pin-count designs.
• Power — Core supply operating range from 0.970 V to 1.03 V to match system power design requirements.
• Package & Mounting — 676‑BBGA / 676‑FCBGA package (supplier package: 676‑FCBGA, 27×27 mm) with surface-mount mounting for compact board-level integration.
• Temperature Range — Rated for operation from −40°C to 100°C, suitable for industrial environments.
• Standards — RoHS compliant for regulatory and environmental compatibility.

Typical Applications

• Industrial Control Systems — Programmable logic and I/O density make it suitable for control and automation equipment operating across industrial temperature ranges.
• Embedded Systems — On-chip memory and substantial logic resources support embedded compute and custom accelerators within constrained footprints.
• I/O-Intensive Designs — With 300 I/Os, the device supports multi-channel interfacing and complex peripheral connectivity on a single FPGA.

Unique Advantages

• High Logic Integration: 65,600 logic elements enable consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Significant On-Chip Memory: Approximately 4.98 Mbits of embedded RAM provides local storage for buffering and state machines without external memory.
• Robust I/O Capability: 300 user I/Os allow for broad peripheral and sensor interfacing without additional IO expanders.
• Industrial Temperature Rating: −40°C to 100°C operation supports deployment in demanding environmental conditions.
• Compact, Surface-Mount Package: The 676‑FCBGA (27×27 mm) package enables high-density PCB designs while facilitating reliable board assembly.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7K70T-2FBG676I?

The XC7K70T-2FBG676I positions itself as a capable industrial-grade Kintex®-7 FPGA option for designs that require a balance of logic density, embedded memory, and extensive I/O in a compact surface-mount package. Its operating range from −40°C to 100°C and RoHS compliance make it appropriate for long-term deployment in industrial applications.

This device is suited to engineers and teams consolidating multiple functions into a single programmable device—providing scalability, integration, and board-level simplification for mid-range FPGA designs.

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