XC7K70T-2FBG484C
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 4976640 65600 484-BBGA, FCBGA |
|---|---|
| Quantity | 190 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 285 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 5125 | Number of Logic Elements/Cells | 65600 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 4976640 |
Overview of XC7K70T-2FBG484C – Kintex®-7 FPGA, 484-FCBGA (23×23), Commercial Grade
The XC7K70T-2FBG484C is a Kintex®-7 Field Programmable Gate Array (FPGA) in a 484-ball FCBGA package designed for commercial embedded applications. It provides a balanced combination of programmable logic density, on-chip memory, and a broad I/O complement for custom digital implementations.
With 65,600 logic elements, approximately 4.98 Mbits of embedded memory, and 285 I/O pins in a 484-FCBGA (23×23) surface-mount package, this device is targeted at engineers who need flexible hardware programmability within a defined commercial temperature and voltage range.
Key Features
- Logic Density Approximately 65,600 logic elements to implement custom digital functions and control logic.
- Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffering, state storage, and local data processing.
- I/O Count 285 user I/O pins enable connectivity to peripherals, interfaces, and custom mezzanine designs.
- Package and Mounting 484-ball BGA, FCBGA package (supplier package: 484-FCBGA 23×23) in a surface-mount form factor for compact board integration.
- Power Supply Core supply range of 0.970 V to 1.03 V to match system power delivery requirements.
- Operating Temperature & Grade Commercial grade device specified for operation from 0 °C to 85 °C.
- Regulatory Compliance RoHS compliant for environmental and manufacturing requirements.
Typical Applications
- Custom Logic and Acceleration Use the device's 65,600 logic elements to implement application-specific hardware acceleration and custom control logic.
- Embedded Memory–Intensive Functions Approximately 4.98 Mbits of embedded RAM supports buffering and local data storage within embedded designs.
- I/O-Rich Interfaces With 285 I/O pins in a compact FCBGA package, the device is suitable for designs requiring multiple parallel or serialized peripheral connections.
- Prototyping and System Integration The surface-mount 484-FCBGA package enables integration into prototype and production PCBs where a commercial-grade FPGA is required.
Unique Advantages
- Balanced Logic Capacity: 65,600 logic elements provide substantial programmable resources for medium-complexity designs without over-specifying capacity.
- On-Chip Memory Availability: Approximately 4.98 Mbits of RAM reduces dependence on external memory for many control and buffering tasks, simplifying BOM and board layout.
- High I/O Count: 285 I/Os streamline system-level connectivity and reduce the need for external I/O expanders in I/O-heavy applications.
- Compact, Surface-Mount Package: 484-FCBGA (23×23) packaging supports dense board layouts while maintaining a standard footprint for manufacturing.
- Defined Power Envelope: A narrow core voltage range (0.970 V–1.03 V) aids predictable power design and regulator selection.
- RoHS Compliant: Compliant status supports environmental and regulatory goals for commercial product lines.
Why Choose XC7K70T-2FBG484C?
The XC7K70T-2FBG484C positions itself as a practical Kintex®-7 FPGA option for commercial designs that require a mix of programmable logic density, embedded memory, and substantial I/O in a compact package. Its combination of approximately 65,600 logic elements, nearly 5 Mbits of on-chip RAM, and 285 I/Os makes it well suited for engineers building custom digital functions, interface bridges, and embedded processing blocks.
Designed for commercial temperature ranges and supplied in a 484-FCBGA surface-mount package, this device offers predictable integration into production PCBs while remaining RoHS compliant. It is a fit for teams seeking scalability and flexibility in programmable hardware within defined electrical and thermal constraints.
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