XC7K70T-1FBG676C

The XC7K70T-1FBG676C is a Kintex®-7 field programmable gate array (FPGA) from AMD designed as a programmable logic device for commercial-grade applications. It provides 65,600 logic elements, approximately 4.98 Mbits of embedded memory, and up to 300 I/O pins in a 676-ball FCBGA package to support complex, board-level digital designs.

Key device attributes include a core supply range of 0.97 V to 1.03 V, surface-mount packaging (676-FCBGA, 27×27), and an operating temperature range of 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Logic Capacity 65,600 logic elements to implement custom combinational and sequential logic, state machines, and datapaths.
• Embedded Memory Approximately 4.98 Mbits of on-chip RAM for buffers, FIFOs, and lookup tables that reduce external memory dependency.
• I/O Count Up to 300 general-purpose I/O pins to support multiple parallel interfaces and board-level connectivity.
• Power and Core Voltage Core supply specified from 0.97 V to 1.03 V to match system-level power design requirements.
• Package and Mounting 676-ball FCBGA (27×27) surface-mount package for compact, board-level integration.
• Operating Conditions Commercial grade with an operating temperature range of 0 °C to 85 °C.
• Environmental Compliance RoHS compliant for adherence to common environmental requirements.

Typical Applications

• Programmable Logic and Glue Logic Implement custom digital logic, protocol translation, and board-level control using the device’s 65,600 logic elements and abundant I/O.
• On-Chip Data Buffering Use approximately 4.98 Mbits of embedded RAM for small data buffers, FIFOs, and lookup tables to accelerate data flow without external memory.
• Multi-Interface Control Manage and aggregate multiple parallel or serial interfaces with the device’s up to 300 I/O pins for system integration tasks.

Unique Advantages

• Significant Logic Density: 65,600 logic elements provide substantial capacity for medium-complexity designs while keeping integration on a single device.
• On-Chip Memory Availability: Approximately 4.98 Mbits of embedded RAM reduces the need for external memory for buffering and small datasets.
• High I/O Count: Up to 300 I/O pins enable flexible connectivity options for board-level interfacing and signal routing.
• Compact Surface-Mount Packaging: 676-FCBGA (27×27) format supports dense PCB layouts in space-constrained designs.
• Commercial-Grade Qualification: Operates across a 0 °C to 85 °C range suitable for commercial applications and environments.
• Regulatory Compliance: RoHS compliant to meet common environmental and procurement requirements.

Why Choose XC7K70T-1FBG676C?

The XC7K70T-1FBG676C balances substantial programmable logic resources, embedded memory, and I/O capacity in a commercial-grade Kintex®-7 FPGA package. Its combination of 65,600 logic elements, approximately 4.98 Mbits of on-chip RAM, and up to 300 I/O pins makes it well suited for board-level designs that require integrated digital logic, interface aggregation, and local data buffering.

Available in a compact 676-FCBGA surface-mount package and designed to operate within a 0.97 V to 1.03 V core supply window and 0 °C to 85 °C temperature range, this device is a practical choice for teams seeking a programmable, vendor-supported FPGA solution for commercial applications.

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