XC7K70T-L2FBG484E

The XC7K70T-L2FBG484E is an AMD Kintex®-7 field programmable gate array (FPGA) supplied in a 484‑ball FCBGA package. It provides a balance of programmable logic capacity, on‑chip memory, and I/O count in a compact surface‑mount package for embedded and board‑level designs.

Key measurable attributes include approximately 65,600 logic elements, roughly 4.98 Mbits of embedded memory, and 285 I/O pins. The device operates from a core supply of 970 mV to 1.03 V and is specified for an operating temperature range of 0 °C to 100 °C; it is RoHS compliant and offered in extended grade.

Key Features

• Core Architecture Kintex‑7 FPGA device from AMD providing programmable logic for custom digital designs.
• Logic Capacity Approximately 65,600 logic elements to implement a wide range of logic functions and state machines.
• Embedded Memory Approximately 4.98 Mbits of on‑chip RAM for buffering, packet storage, and intermediate data handling.
• I/O Resources 285 I/O pins to support parallel interfaces, control signals, and board‑level integration.
• Power Supply Core supply specified from 970 mV to 1.03 V to match Kintex‑7 core requirements.
• Package & Mounting 484‑ball FCBGA (23 × 23) package, surface mount for high‑density PCB applications.
• Temperature & Grade Extended grade device rated for 0 °C to 100 °C operating temperature.
• Environmental Compliance RoHS compliant for regulatory and manufacturing requirements.

Unique Advantages

• Substantial logic capacity: Approximately 65,600 logic elements enable complex custom logic implementations without immediate upscaling.
• Significant on‑chip memory: Nearly 5 Mbits of embedded RAM reduces dependence on external memory for many buffering and data path tasks.
• High I/O count: 285 I/Os facilitate multiple parallel interfaces and flexible board integration options.
• Compact, industry‑grade packaging: 484‑ball FCBGA (23×23) provides a dense footprint for space‑constrained PCBs while supporting surface‑mount assembly.
• Controlled power envelope: Defined core supply range (970 mV–1.03 V) helps with predictable power budgeting and board design.
• Extended temperature rating: 0 °C to 100 °C operation supports applications requiring wider commercial‑range thermal performance.

Why Choose XC7K70T-L2FBG484E?

The XC7K70T-L2FBG484E positions itself as a mid‑range Kintex‑7 FPGA option that combines measurable logic capacity, embedded memory, and a high I/O complement in a compact 484‑ball FCBGA package. Its extended grade and RoHS compliance make it suitable for designs that require a balance of integration and predictable operating conditions.

This device is appropriate for development teams and procurement groups seeking a programmable logic solution with clear, verifiable specifications for logic elements, on‑chip RAM, I/O count, package type, and operating conditions. It provides scalability within the Kintex‑7 footprint while delivering quantifiable resources for system designers.

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