XC7K480T-3FFG1156E

IC FPGA 400 I/O 1156FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 35205120 477760 1156-BBGA, FCBGA

Quantity 656 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package1156-FCBGA (35x35)GradeExtendedOperating Temperature0°C – 100°C
Package / Case1156-BBGA, FCBGANumber of I/O400Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs37325Number of Logic Elements/Cells477760
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits35205120

Overview of XC7K480T-3FFG1156E – Kintex®-7 FPGA, 1156‑BBGA (FCBGA)

The XC7K480T-3FFG1156E is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD offered in a 1156-ball FCBGA package. It provides a large programmable fabric with substantial on-chip memory and high I/O capacity for complex digital designs.

With 477,760 logic elements, approximately 35.2 Mbits of embedded memory and 400 user I/Os, this surface-mount FPGA targets designs that require significant logic density, on-chip storage and flexible I/O routing within a compact FCBGA footprint.

Key Features

  • Programmable logic: 477,760 logic elements provide a large fabric for implementing custom logic, datapaths and hardware accelerators.
  • Embedded memory: Approximately 35.2 Mbits of on-chip RAM to support buffering, lookup tables and local data storage without relying on external memory.
  • I/O capacity: 400 user I/O pins to accommodate multiple interfaces, parallel buses and mixed-signal front-end connections.
  • Package and mounting: 1156‑BBGA FCBGA package (supplier device package: 1156-FCBGA, 35×35) designed for surface-mount assembly in space-constrained applications.
  • Power supply range: Core voltage supply specified from 970 mV to 1.03 V for predictable power budgeting and system design.
  • Operating range and grade: Extended grade device rated for 0 °C to 100 °C operating temperature.
  • Regulatory compliance: RoHS compliant to meet common environmental requirements.

Typical Applications

  • High-density logic integration: Implement complex state machines, protocol engines and custom datapaths using the large logic element count and on-chip RAM.
  • Data buffering and packet processing: Leverage approximately 35.2 Mbits of embedded memory together with abundant I/O for packet queues, FIFOs and temporary storage in communication or networking designs.
  • Multi-interface systems: Use 400 I/Os to connect sensors, serializers/deserializers, parallel buses and control interfaces in embedded systems and instrumentation.

Unique Advantages

  • Large programmable fabric: 477,760 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Substantial on-chip memory: Approximately 35.2 Mbits of embedded RAM minimizes dependence on external memory and improves latency for local data processing.
  • High I/O count: 400 user I/Os provide flexibility for routing numerous interfaces without additional I/O expanders.
  • Compact FCBGA package: The 1156-ball FCBGA (35×35) balances density and board space, supporting surface-mount assembly in compact designs.
  • Defined power window: Core voltage supply specification (970 mV to 1.03 V) supports predictable power design and supply planning.
  • Extended temperature grade: Rated for 0 °C to 100 °C operation to meet a range of commercial and extended-environment applications.

Why Choose XC7K480T-3FFG1156E?

The XC7K480T-3FFG1156E combines a large logic element count, significant embedded memory and a high I/O complement in a compact 1156-ball FCBGA package, offering a balanced platform for demanding FPGA-based system designs. Its defined voltage supply range and extended temperature rating make it suitable for projects that require predictable electrical and thermal characteristics.

This device is well suited to engineers developing complex digital systems that need on-chip resources to reduce external components, simplify board layout and centralize functionality. Backed by Kintex-7 family documentation, it provides a scalable option for integrating substantial logic, memory and I/O into a single FPGA solution.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7K480T-3FFG1156E. Our team can assist with lead time and ordering details.

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