XC7K480T-2FFG1156I

The XC7K480T-2FFG1156I is a Kintex®-7 field programmable gate array (FPGA) from AMD designed for high-density, memory-rich programmable logic applications. It integrates approximately 477,760 logic elements and approximately 35 Mbits of embedded memory with 400 user I/O pins in a 1156-ball FCBGA package, targeting industrial applications that require substantial logic capacity, on-chip memory, and robust I/O connectivity.

Key Features

• Logic Capacity  Provides 477,760 logic elements to implement large-scale combinational and sequential logic designs.
• Embedded Memory  Approximately 35 Mbits of on-chip RAM to support data buffering, large FIFOs, and memory-intensive processing.
• I/O Density  400 user I/O pins enable connectivity to multiple peripherals, high-speed interfaces, and complex interconnect schemes.
• Package and Mounting  1156-ball FCBGA package (1156-FCBGA, 35×35) in a surface-mount format for compact, board-level integration.
• Power Supply  Core voltage range specified at 970 mV to 1.03 V for accurate power planning and supply design.
• Operating Range  Industrial-grade temperature capability from −40°C to 100°C for deployment in demanding environments.
• Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

• Industrial Control  Use in programmable logic control, motion control, and data aggregation systems that require high logic density and wide temperature operation.
• High-Density Signal Processing  Implement custom DSP pipelines and real-time processing with extensive on-chip memory and large logic resources.
• I/O-Intensive Systems  Serve as a central FPGA in systems that need numerous external interfaces or parallel I/O streams.

Unique Advantages

• Large Logic Footprint: 477,760 logic elements enable complex designs without immediate need for multi-FPGA partitioning.
• Substantial On-Chip Memory: Approximately 35 Mbits of embedded RAM reduces dependence on off-chip memory for buffering and state storage.
• High I/O Count: 400 I/O pins simplify integration with multiple peripherals and sensors, reducing external bridging components.
• Industrial Temperature Rating: −40°C to 100°C operating range supports deployment in industrial environments with wide temperature swings.
• Compact Package: 1156-FCBGA (35×35) surface-mount package provides high density in a board-friendly footprint.
• Manufacturer Backing: Part of the AMD Kintex®-7 family, offering continuity with documented device specifications and family-level resources.

Why Choose XC7K480T-2FFG1156I?

The XC7K480T-2FFG1156I positions itself as a high-capacity, industrial-grade FPGA option for engineers designing logic- and memory-intensive systems that also demand significant I/O. Its combination of nearly half a million logic elements, approximately 35 Mbits of embedded memory, and 400 I/Os in an industry-standard FCBGA package makes it suitable for centralized processing, high-throughput signal handling, and compact board implementations.

Backed by AMD's Kintex®-7 family specifications, this device offers a scalable platform for designers who need long-term part availability, documented device characteristics, and an FPGA with industrial temperature capability to meet robust application requirements.

Request a quote or submit your procurement inquiry today to evaluate the XC7K480T-2FFG1156I for your next high-density, industrial FPGA design.