XC7K420T-2FFG1156C

The XC7K420T-2FFG1156C is an AMD Kintex®-7 field programmable gate array (FPGA) supplied in a 1156-FCBGA surface-mount package (35×35 mm). It provides a high logic element count, substantial embedded memory, and a 400-pin I/O complement for commercial electronic designs.

Designed for applications that require configurable logic capacity, on-chip memory resources, and a high number of I/O signals, this device offers a balance of integration and power-range operation for commercial-grade systems.

Key Features

• Core Logic — Approximately 416,960 logic elements to implement complex digital logic and custom processing functions.
• Configurable Logic Blocks — 32,575 logic blocks for building flexible, modular logic architectures.
• Embedded Memory — Approximately 30.78 Mbits of on-chip RAM to support buffers, frame stores, and algorithm state without external memory.
• I/O Capability — 400 user I/O pins to interface with high-pin-count peripherals and system buses.
• Package and Mounting — 1156-FCBGA (35×35) ball-grid array in a surface-mount format for compact board-level integration.
• Power Supply Range — Core voltage range from 0.970 V to 1.03 V to match system power-rail specifications.
• Operating Temperature — Commercial grade operation from 0 °C to 85 °C suitable for standard commercial environments.
• Compliance — RoHS compliant for environmental and assembly requirements.

Typical Applications

• High-density signal processing — Implement custom DSP pipelines and parallel processing using the device’s large logic and memory resources.
• Interface bridging and protocol implementation — Use the 400 I/O pins to connect multiple high-speed interfaces and translate between protocols on a single device.
• Embedded system acceleration — Offload compute-intensive tasks to FPGA logic and on-chip RAM to improve system throughput.

Unique Advantages

• High logic capacity: Approximately 416,960 logic elements provide the headroom to implement complex state machines, custom accelerators, and wide datapaths.
• Significant on-chip RAM: Approximately 30.78 Mbits of embedded memory reduces dependence on external RAM for intermediate storage and buffering.
• Large I/O complement: 400 I/O pins enable dense peripheral integration and flexible board-level partitioning.
• Compact FCBGA package: The 1156-FCBGA (35×35) package supports high pin count in a compact footprint for space-constrained designs.
• Commercial temperature rating: Rated for 0 °C to 85 °C operation to match typical commercial product environments.
• RoHS compliant: Meets common environmental and manufacturing requirements for lead-free assembly.

Why Choose XC7K420T-2FFG1156C?

The XC7K420T-2FFG1156C combines high logic density, substantial embedded memory, and a large I/O count in a compact 1156-FCBGA surface-mount package, making it suitable for commercial designs that require on-chip resources and flexible interfacing. Its specified core voltage range and commercial operating temperature provide clear parameters for system power and thermal planning.

This device is appropriate for engineering teams building complex digital systems that need programmable logic capacity, embedded RAM, and many I/O signals while maintaining a compact board footprint and RoHS-compliant assembly.

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