XC7K410T-L2FFG900I

The XC7K410T-L2FFG900I is a Kintex®-7 field programmable gate array (FPGA) IC offering a high density of programmable logic and embedded memory in a 900-ball FCBGA package. It targets designs that require large logic capacity, substantial on-chip RAM, and a high number of I/O pins within an industrial temperature range.

With approximately 406,720 logic elements, roughly 29.3 Mbits of embedded memory, and up to 500 user I/O, this device provides the integration and flexibility needed for complex digital systems while operating on a low-voltage core supply.

Key Features

• Logic Capacity  Approximately 406,720 logic elements to implement complex algorithms, signal processing, and control logic.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM for buffering, frame storage, and state machines.
• I/O Resources  Up to 500 general-purpose I/O pins to support broad interfacing and parallel data paths.
• Core Voltage Range  Operates from 970 mV to 1.03 V for the core supply, enabling predictable power design around the device core.
• Package & Mounting  900-FCBGA (31 × 31) supplier device package; 900-BBGA, FCBGA package case suitable for surface-mount PCB assembly.
• Temperature & Grade  Industrial-grade device with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS compliant, meeting common lead-free and restricted-substance requirements.

Unique Advantages

• High logic density: Approximately 406,720 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Substantial on-chip memory: Around 29.3 Mbits of embedded RAM supports large buffers and local data storage, minimizing external memory dependencies.
• Extensive I/O connectivity: 500 I/O pins enable flexible interfacing options for parallel buses, high-pin-count peripherals, and diverse mezzanine connections.
• Compact, manufacturable package: 900-FCBGA (31 × 31) surface-mount package balances high pin count with a compact footprint for space-constrained designs.
• Industrial readiness: Rated for −40 °C to 100 °C operation and RoHS compliant for deployment in industrial applications with environmental and regulatory considerations.
• Low-voltage core operation: Core supply range of 970 mV to 1.03 V supports tightly controlled power architectures and consistency across production units.

Why Choose XC7K410T-L2FFG900I?

The XC7K410T-L2FFG900I combines substantial logic capacity, sizable embedded memory, and a high I/O count in a single industrial-grade FPG A package. Its specification set makes it well suited for engineering teams seeking integration of complex digital functions while maintaining design flexibility and board-level compactness.

This part is appropriate for customers requiring a high-density programmable device with defined operating voltage and temperature parameters, and who prioritize RoHS-compliant components for long-term deployments and supply-chain consistency.

If you would like pricing, availability, or to request a formal quote for the XC7K410T-L2FFG900I, submit a quote request or request a sales inquiry referencing the full part number.