XC7K410T-L2FFG676I

The XC7K410T-L2FFG676I is a Kintex‑7 Field Programmable Gate Array (FPGA) in a 676‑ball FCBGA package, designed for industrial applications requiring high-density programmable logic. It provides a large logic fabric and embedded memory along with extensive I/O and a controlled core voltage range to support complex, board-level digital systems.

Key Features

• Core Logic  Approximately 406,720 logic elements for implementing large combinational and sequential designs.
• Embedded Memory  Approximately 29.3 Mbits of embedded memory for buffering, lookup tables, and on-chip data storage.
• I/O Count  400 user I/O pins to support multiple high‑pin‑count interfaces and peripheral connections.
• Package  676‑BBGA FCBGA package (676‑FCBGA, 27×27) in a surface‑mount form factor for compact, high‑density board designs.
• Power Supply  Specified core voltage range from 0.970 V to 1.03 V for predictable power integration and sequencing.
• Temperature Range  Industrial operating range of −40 °C to 100 °C for deployment in ambient‑challenging environments.
• Compliance  RoHS compliant to meet environmental and material requirements.

Typical Applications

• High‑density digital processing  Use the large logic element count and embedded memory to implement complex protocol engines, data packet processing, or custom compute pipelines.
• Interface aggregation  Leverage 400 I/O pins to consolidate multiple peripheral and high‑pin‑count interfaces onto a single FPGA fabric.
• Industrial control systems  Industrial temperature rating and surface‑mount packaging suit board‑level designs for factory automation and instrumentation.

Unique Advantages

• Large programmable fabric  Approximately 406,720 logic elements allow integration of multiple subsystems on a single device, reducing external components.
• Significant on‑chip memory  About 29.3 Mbits of embedded memory supports buffering and state storage without immediate dependence on external RAM.
• High I/O density  400 I/O pins enable flexible connectivity for complex board designs and multiple simultaneous interfaces.
• Industrial temperature capability  Rated from −40 °C to 100 °C to maintain operation across a wide range of environmental conditions.
• Compact BGA package  676‑ball FCBGA (27×27) surface‑mount package supports high‑density PCB layouts while providing a robust soldered connection.
• Regulatory readiness  RoHS compliance simplifies material and manufacturing considerations for many markets.

Why Choose XC7K410T-L2FFG676I?

The XC7K410T-L2FFG676I positions itself as a high‑capacity, industrial‑rated FPGA option that combines a substantial number of logic elements and embedded memory with a high pin count and a compact FCBGA package. It is suited to designers who need to consolidate complex digital functions and multiple interfaces into a single programmable device while meeting industrial temperature and material requirements.

Its specified core voltage range and surface‑mount 676‑FCBGA footprint make it practical for system designers focused on scalable, board‑level FPGA implementations where integration density, on‑chip memory, and I/O availability drive design choices.

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