XC7K410T-3FFG676E

The XC7K410T-3FFG676E is a high-density Kintex®-7 FPGA from AMD designed for complex programmable logic implementations. It combines a large logic capacity with substantial on-chip memory and a 400-pin I/O footprint to support demanding, I/O‑rich designs.

This device is offered in a compact 676‑FBGA package and operates over a core supply range of 0.970 V to 1.03 V with an extended temperature grade of 0 °C to 100 °C, making it suitable for robust embedded applications that require significant logic and memory resources.

Key Features

• High Logic Capacity — 406,720 logic elements to implement large, complex digital designs and parallel processing tasks.
• On‑chip Memory — Approximately 29.3 Mbits of embedded memory for buffering, lookup tables, and local storage needs within the FPGA fabric.
• Generous I/O Count — 400 I/O pins to support wide bus interfaces, multiple peripherals, or high-speed external connectivity.
• Package and Mounting — 676‑FCBGA (27 × 27) surface mount package that provides a compact footprint for board-level integration.
• Power Supply Range — Core voltage operating range of 0.970 V to 1.03 V to match system power domains and regulator designs.
• Operating Temperature and Grade — Extended grade with an operating range of 0 °C to 100 °C for deployment in a variety of embedded environments.
• Compliance — RoHS compliant to support regulatory requirements for lead‑free manufacturing.

Typical Applications

• High‑density logic implementations — Deploy the XC7K410T where large numbers of logic elements are needed for complex state machines, signal processing, or parallel compute functions.
• Memory‑intensive designs — Use the approximately 29.3 Mbits of embedded memory for buffering, packet storage, or on‑chip data structures that reduce external memory dependence.
• I/O‑centric systems — Ideal for designs requiring extensive external interfacing, leveraging the 400 available I/O pins for broad peripheral and bus connectivity.

Unique Advantages

• Large programmable fabric: 406,720 logic elements provide the scale to consolidate multiple functions into a single device and reduce overall BOM complexity.
• Substantial embedded memory: Approximately 29.3 Mbits of on‑chip RAM enable local data storage and low‑latency access for performance‑sensitive logic.
• High I/O density: 400 I/O pins support dense external interfaces without sacrificing board routing flexibility.
• Compact, board‑ready package: 676‑FCBGA (27 × 27) surface mount package simplifies high‑density PCB integration.
• Extended operating range: 0 °C to 100 °C grade supports a broad set of embedded environments where thermal headroom is required.
• RoHS compliant: Meets lead‑free manufacturing requirements to support contemporary production processes.

Why Choose XC7K410T-3FFG676E?

The XC7K410T-3FFG676E provides a balance of high logic capacity, substantial embedded memory, and ample I/O in a compact FCBGA package. It is well suited to engineering teams building complex, memory‑aware, and I/O‑intensive FPGA solutions that benefit from a single, integrated device.

With AMD Kintex‑7 classification and extended temperature operation, this device is positioned for long‑lifecycle embedded projects that require predictable supply characteristics, scalability within the FPGA family, and RoHS‑compatible manufacturing.

Request a quote or submit an inquiry to receive pricing and availability for the XC7K410T-3FFG676E and begin integrating this high‑capacity Kintex®‑7 FPGA into your next design.