XC7K410T-3FBG900E

The XC7K410T-3FBG900E is a Kintex®-7 Field Programmable Gate Array (FPGA) in a 900-FCBGA package. It provides high logic density and substantial embedded memory in a surface-mount FCBGA footprint for applications that require large programmable resources.

With 406,720 logic elements and approximately 29.3 Mbits of on-chip RAM, the device targets designs that need extensive programmable logic, significant embedded memory, and a large number of I/O signals while operating from a core supply in the 0.970 V–1.03 V range.

Key Features

• Logic Capacity 406,720 logic elements suitable for large-scale programmable logic implementations.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM to support buffering, frame storage, and local algorithm data.
• I/O Density 500 user I/Os to interface with high-channel-count systems and multiple external devices.
• Package 900-FCBGA (31×31) package providing a high-pin-count, surface-mount solution for compact, high-density boards.
• Power Core supply range of 0.970 V to 1.03 V to match system power-rail constraints and design requirements.
• Thermal and Grade Extended-grade device with an operating temperature range of 0 °C to 100 °C.
• Mounting Surface-mount package suited for modern PCB assembly processes.
• Environmental Compliance RoHS compliant for global environmental requirements.

Typical Applications

• Communications and Networking Protocol processing, packet inspection, and custom network functions that benefit from high logic density and large I/O counts.
• Computation and Acceleration FPGA-based acceleration and compute offload tasks that require extensive logic resources and on-chip memory.
• Video and Imaging High-throughput video pipelines and image processing chains that use embedded RAM for frame buffering and logic for parallel data paths.

Unique Advantages

• High Logic Density: 406,720 logic elements enable complex gateware and large-scale designs without external logic expansion.
• Substantial On-Chip Memory: Approximately 29.3 Mbits of embedded RAM reduces dependence on external memory for buffering and intermediate storage.
• Extensive I/O Count: 500 user I/Os provide flexibility for multi-channel interfaces and rich peripheral connectivity.
• Compact, High-Pin Package: 900-FCBGA (31×31) delivers high pin density in a surface-mount form factor for space-constrained PCBs.
• Clear Power Envelope: Defined core supply range (0.970 V–1.03 V) simplifies power-supply planning and integration.
• RoHS Compliant: Meets environmental compliance requirements for manufacturing and distribution.

Why Choose XC7K410T-3FBG900E?

The XC7K410T-3FBG900E positions itself as a high-density programmable solution that combines a very large logic element count with substantial embedded memory and broad I/O capability. Its extended-grade operating range and surface-mount 900-FCBGA package make it suitable for designs that need significant integration while adhering to common thermal and assembly constraints.

This device is ideal for engineering teams building feature-rich, high-performance FPGA solutions that require on-chip memory and a large number of I/Os. The combination of logic, memory, and package density delivers long-term value for scalable designs that demand robust programmable resources.

Request a quote or submit a procurement inquiry to get pricing and availability for the XC7K410T-3FBG900E.