XC7K410T-2FFV900C

The XC7K410T-2FFV900C is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD. It delivers high logic capacity and significant on-chip memory in a 900-ball FCBGA package.

Key device attributes include 406,720 logic elements, approximately 29.3 Mbits of embedded memory, 500 user I/Os, a supply voltage range of 970 mV to 1.03 V, and commercial-grade operation from 0 °C to 85 °C. The device is RoHS compliant.

Key Features

• Core Capacity  Provides 406,720 logic elements for implementing large-scale programmable logic and complex functions.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM to support buffer, FIFO, and data-path storage needs.
• I/O Density  Up to 500 user I/Os to support wide parallel interfaces and multiple peripheral connections.
• Supply Voltage  Operates within a supply range of 970 mV to 1.03 V, enabling defined core power delivery requirements.
• Package  Supplied in a 900-ball FCBGA (900-FCBGA, 31×31) package for compact, high-density board integration.
• Commercial Temperature Range  Rated for operation from 0 °C to 85 °C for standard commercial applications.
• Environmental Compliance  RoHS compliant to meet common regulatory environmental requirements.

Typical Applications

• Custom Logic Implementations  High-capacity programmable logic using 406,720 logic elements enables complex, application-specific architectures.
• On-Chip Data Buffering  Approximately 29.3 Mbits of embedded memory supports buffering, queuing, and intermediate data storage in data-path designs.
• High-Density I/O Systems  Up to 500 I/Os accommodate wide parallel buses, multiple interfaces, and mixed-signal connectivity requirements.

Unique Advantages

• High Logic Density:  406,720 logic elements allow implementation of large, integrated logic functions without partitioning across multiple devices.
• Substantial Embedded Memory:  Approximately 29.3 Mbits of RAM reduces the need for external memory in many buffering and streaming use cases.
• Extensive I/O Count:  500 user I/Os provide flexibility for interfacing to a broad set of peripherals and high-pin-count designs.
• Compact FCBGA Package:  900-FCBGA (31×31) package enables a compact PCB footprint while supporting high pin density.
• Commercial-Grade Reliability:  Rated for 0 °C to 85 °C operation and RoHS compliant to meet common commercial deployment requirements.

Why Choose XC7K410T-2FFV900C?

The XC7K410T-2FFV900C positions itself as a high-capacity Kintex®-7 FPGA from AMD, combining large logic resources, significant embedded memory, and a high I/O count in a compact 900-FCBGA package. Its electrical and thermal specifications are suited to commercial applications that require substantial programmable logic and on-chip storage.

This device is ideal for design teams seeking a single-chip solution to integrate complex logic, high-throughput interfaces, and on-chip buffering while maintaining a compact board footprint and adherence to RoHS environmental requirements.

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