XC7K410T-L2FBG676E

The XC7K410T-L2FBG676E is a Kintex®-7 Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 676‑ball FCBGA package (27×27). It offers high logic density and on-chip memory in a surface-mount form factor targeted at designs that require substantial programmable logic, abundant I/O, and embedded RAM.

With 406,720 logic elements, approximately 29.3 Mbits of embedded memory, and 400 user I/O pins, this extended‑grade device is suited for applications where integration of logic, memory, and high I/O count is a priority. The device operates from a 0.97 V to 1.03 V core supply and across an operating temperature range of 0 °C to 100 °C.

Key Features

• Core Logic  406,720 logic elements provide substantial programmable logic capacity for complex designs and custom hardware implementations.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM for buffering, lookup tables, and data storage without external memory.
• I/O Capacity  400 user I/O pins support broad interfacing options for parallel buses, high-pin-count connectors, and multi‑lane interfaces.
• Power  Core voltage supply specification of 970 mV to 1.03 V enables integration with modern low‑voltage power domains.
• Package & Mounting  676‑FCBGA (27×27) package in a surface‑mount format simplifies board placement for compact, high‑density PCBs.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C for use in a variety of ambient environments.
• Compliance  RoHS‑compliant construction supports environmental and regulatory requirements for lead‑free assembly.

Typical Applications

• High-density digital processing  Use the device’s large logic capacity and on-chip RAM for custom datapath acceleration, signal processing, and compute‑intensive tasks.
• Prototyping and IP integration  Implement and evaluate complex intellectual property cores with abundant logic and I/O resources for system validation.
• Communications and I/O aggregation  Leverage 400 I/O pins to aggregate multiple interfaces, perform protocol bridging, or implement large connectivity matrices.
• Instrumentation and test equipment  Deploy the FPGA for flexible control, data capture, and preprocessing where reconfigurable logic and embedded RAM are beneficial.

Unique Advantages

• High logic density: 406,720 logic elements enable consolidation of complex functions into a single device, reducing system BOM.
• Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM reduces dependence on external memory and improves data throughput.
• Large I/O count: 400 user I/Os provide flexibility for multi‑channel designs and high‑pin‑count interfaces without external expanders.
• Compact FCBGA package: The 676‑ball FCBGA (27×27) supports dense PCB layouts while maintaining solderable surface‑mount compatibility.
• Extended operating range: Rated for 0 °C to 100 °C operation and RoHS compliance to meet common assembly and environmental requirements.

Why Choose XC7K410T-L2FBG676E?

The XC7K410T-L2FBG676E is positioned for designers who need a high‑capacity, reconfigurable logic device with significant on‑chip memory and a large number of user I/Os in a compact FCBGA package. Its combination of 406,720 logic elements, roughly 29.3 Mbits of embedded RAM, and 400 I/Os supports consolidation of complex functions and interfaces onto a single FPGA.

With a specified core voltage range of 0.97 V to 1.03 V, extended grade temperature rating, surface‑mount 676‑ball package, and RoHS compliance, this part provides a practical balance of integration and robustness for development, prototyping, and production designs that require substantial programmable resources.

Request a quote or submit an inquiry today to secure XC7K410T-L2FBG676E parts and pricing for your next design.