XC7K410T-2FF900I

The XC7K410T-2FF900I is a Kintex®-7 field programmable gate array (FPGA) by AMD, designed for high-density, reconfigurable digital logic implementations. With 406,720 logic elements and approximately 29 Mbits of on-chip RAM, this device targets designs that require substantial logic capacity, embedded memory, and a large number of I/O pins.

Packaged in a 900-ball FCBGA and rated for industrial temperature operation, the part is suitable for systems where logic density, I/O count, and predictable operating ranges are key considerations for system architects and procurement teams.

Key Features

• Core Logic Density  406,720 logic elements provide substantial programmable logic capacity for complex digital functions and custom accelerator implementations.
• Logic Fabric  31,775 CLBs (configurable logic blocks) to organize and map large-scale logic designs efficiently.
• Embedded Memory  Approximately 29 Mbits of on-chip RAM to support buffering, packet storage, and intermediate data processing without external memory.
• I/O Capability  500 user I/O pins to support wide bus interfaces, multiple peripherals, and high-pin-count system integration.
• Power  Supported core voltage supply range of 970 mV to 1.03 V, enabling defined power planning for the FPGA core domain.
• Package  900-FCBGA (31 × 31 mm) package for high-pin-count board designs and compact footprint integration.
• Temperature & Grade  Industrial grade operation with an operating temperature range of −40 °C to 100 °C for deployments in demanding environments.
• Compliance  RoHS-compliant for regulatory and manufacturing considerations.

Typical Applications

• Communications Equipment  High logic capacity and 500 I/O allow implementation of custom protocol handling, parallel interfaces, and aggregation functions.
• Data Processing & Acceleration  Large number of logic elements and on-chip RAM support custom data-paths and hardware accelerators for compute-intensive tasks.
• Industrial Control  Industrial temperature rating and robust I/O make the device suitable for control systems, PLCs, and deterministic I/O handling.
• Test & Measurement  Rich logic resources and extensive I/O enable custom signal processing, timing-critical measurement logic, and multi-channel data capture.

Unique Advantages

• High Logic Capacity: 406,720 logic elements accommodate large, complex designs without immediate need for multiple devices.
• Substantial On-Chip Memory: Approximately 29 Mbits of embedded RAM reduce reliance on external memory for buffering and intermediate storage.
• Large I/O Surface: 500 I/O pins provide flexibility for wide buses, multiple interfaces, and modular system architectures.
• Industrial Temperature Range: −40 °C to 100 °C operation supports deployment in environments with wide temperature swings.
• Compact High-Pin Package: 900-FCBGA packaging consolidates a high I/O count in a compact footprint for space-constrained boards.
• Defined Core Power Window: Core voltage range of 970 mV to 1.03 V aids in power budgeting and thermal planning for system designers.

Why Choose XC7K410T-2FF900I?

The XC7K410T-2FF900I positions itself as a high-density Kintex®-7 FPGA option for designs that need a large programmable fabric, significant embedded memory, and a wide complement of I/O in an industrial-grade package. Its combination of logic elements, CLBs, and on-chip RAM supports complex data-paths and custom accelerators while simplifying board-level component choices.

This device is well suited to engineering teams and procurement organizations building advanced communications, data processing, and industrial systems where scalability, integration density, and predictable operating limits are priorities.

Request a quote or submit a procurement inquiry to obtain pricing, availability, and lead-time information for the XC7K410T-2FF900I.