XC7K410T-2FBG900I

The XC7K410T-2FBG900I is a Kintex®-7 Field Programmable Gate Array (FPGA) offered in a 900-ball FCBGA package. It provides a large programmable fabric with a high I/O count and substantial on-chip memory suitable for complex, custom digital logic implementations.

With hundreds of thousands of logic elements, approximately 29.3 Mbits of embedded memory and 500 I/O pins, this device targets applications that require dense logic integration, flexible I/O interfacing and industrial temperature operation.

Key Features

• Programmable Logic Capacity — 406,720 logic elements for implementing large, complex custom logic functions and system-level integration.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM to support data buffering, look-up tables and intermediate storage without external memory dependency.
• I/O Resources — 500 user I/O pins to enable broad peripheral and interface connectivity for multi-channel designs.
• Power Supply Range — Core voltage specified from 970 mV to 1.03 V, allowing precise power planning for the FPGA core.
• Package and Mounting — 900-FCBGA (31×31) / 900-BBGA package in a surface-mount form factor to support compact, high-density board layouts.
• Industrial Temperature Grade — Rated for operation from -40 °C to 100 °C, supporting industrial-environment deployments.
• Environmental Compliance — RoHS compliant to meet common regulatory and manufacturing requirements.

Typical Applications

• Custom Digital Systems — Implement complex, application-specific datapaths and control logic using the large logic-element count and embedded memory.
• High-Density I/O Interfaces — Leverage 500 I/O pins to connect multiple peripherals, sensors or high-speed interfaces on a single device.
• Embedded Prototyping and Development — Use the FPGA fabric and on-chip RAM for system validation, algorithm prototyping and iterative hardware/software integration.

Unique Advantages

• Extensive Logic Resources: 406,720 logic elements enable consolidation of multiple functions into a single device, reducing board-level component count.
• Substantial On-Chip Memory: Approximately 29.3 Mbits of embedded RAM supports data buffering and local storage, minimizing external memory needs.
• High I/O Density: 500 I/O pins provide flexibility to interface with numerous peripherals and mixed-signal front ends without external multiplexing.
• Industrial Temperature Operation: Specified operation from -40 °C to 100 °C makes the device suitable for deployment in a wide range of environmental conditions.
• Compact, Surface-Mount Package: 900-FCBGA (31×31) package supports high-density PCB layouts and automated assembly processes.
• Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing practices.

Why Choose XC7K410T-2FBG900I?

The XC7K410T-2FBG900I positions itself as a high-capacity Kintex®-7 FPGA option offering a balance of large logic resources, significant embedded memory and broad I/O capability in a compact 900-ball FCBGA package. Its industrial temperature rating and surface-mount package make it suitable for demanding embedded designs that require both integration density and robust environmental performance.

This device is well suited for engineering teams developing complex custom logic, multi-interface systems, or dense prototyping platforms where on-chip resources and I/O count reduce external components and simplify board design. The combination of logic, memory and I/O provides long-term design scalability for evolving system requirements.

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