XC7K410T-2FBG900C

The XC7K410T-2FBG900C is a Kintex®-7 field programmable gate array (FPGA) IC from AMD, offered in a 900-ball FCBGA package. It combines a high count of logic resources with significant on-chip memory and broad I/O capability for board-level integration.

With 406,720 logic elements and approximately 29.3 Mbits of embedded memory, this commercial-grade device is suited to designs that require substantial logic density, embedded storage, and a large number of interface pins while operating within a standard commercial temperature range.

Key Features

• Logic Capacity  406,720 logic elements provide substantial programmable fabric for complex digital functions and custom acceleration.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM support buffering, data storage, and memory-intensive logic implementations.
• I/O Count  500 I/O pins enable extensive connectivity to external devices, sensors, and high-speed interfaces at the board level.
• Package and Mounting  Supplied in a 900-FCBGA (31×31) package with surface-mount mounting for compact, board-level deployment.
• Power Supply Range  Operates with a core voltage supply in the range of 0.97 V to 1.03 V to match system power rails and design constraints.
• Temperature and Grade  Commercial grade operation from 0 °C to 85 °C for standard consumer and industrial electronics applications.
• Regulatory Status  RoHS compliant to meet lead-free and restricted-substance requirements in manufacturing.

Typical Applications

• Logic-Intensive Acceleration  High logic capacity supports custom compute blocks, signal processing engines, and hardware accelerators.
• Memory-Dependent Designs  On-chip RAM is useful for buffering, packet processing, and intermediate data staging in real-time systems.
• High Pin-Count Interface Systems  500 I/O pins enable multi-channel I/O, interface bridging, and extensive peripheral integration on a single device.

Unique Advantages

• High Logic Density: 406,720 logic elements allow consolidation of complex functions into a single FPGA, reducing system component count.
• Substantial Embedded Memory: Approximately 29.3 Mbits of on-chip RAM reduces reliance on external memory and lowers system latency.
• Extensive I/O: 500 I/O pins provide flexibility for multi-protocol designs and numerous peripheral connections.
• Compact, Board-Ready Package: 900-FCBGA (31×31) surface-mount package supports dense PCB layouts and streamlined assembly.
• Commercial Temperature Range: Rated 0 °C to 85 °C to match typical consumer and commercial deployment environments.
• RoHS Compliant: Meets lead-free manufacturing requirements for regulated markets.

Why Choose XC7K410T-2FBG900C?

The XC7K410T-2FBG900C positions itself as a high-capacity Kintex®-7 FPGA option for designs that require a blend of large logic resources, meaningful embedded memory, and broad I/O connectivity in a compact FCBGA package. Its commercial-grade temperature range and RoHS compliance make it suitable for a wide range of consumer and commercial electronics.

This device is well suited for developers and system designers tackling mid- to high-complexity FPGA implementations where on-chip memory and pin count directly impact system architecture and board-level integration.

If you would like pricing or availability, request a quote or submit an inquiry to receive further purchasing information and lead-time details.