XC7K410T-1FFG900C

The XC7K410T-1FFG900C is a Kintex®-7 field programmable gate array (FPGA) in a 900‑ball FCBGA package. It delivers substantial programmable logic and embedded memory capacity along with a large I/O count for designs that require significant on-chip resources and connectivity.

With a core supply range of 970 mV to 1.03 V and a commercial operating temperature range of 0 °C to 85 °C, this device targets system designs where integration of logic, memory, and I/O density are primary requirements.

Key Features

• Programmable Logic Capacity  Approximately 406,720 logic elements (31,775 CLBs) to implement complex custom logic and datapaths.
• Embedded Memory  Approximately 29.3 Mbits of on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density  500 user I/Os to support wide parallel interfaces, multiple high-pin-count peripherals, or dense board-level connectivity.
• Package & Mounting  900‑ball FCBGA (900‑FCBGA, 31×31) package, surface-mount mounting type for board-level integration.
• Power  Core voltage supply specified from 970 mV to 1.03 V for required power rail planning.
• Temperature & Grade  Commercial grade device rated for operation from 0 °C to 85 °C.
• Environmental Compliance  RoHS compliant to meet common lead-free assembly requirements.

Typical Applications

• High‑density digital processing  Implement complex algorithmic pipelines and custom datapaths using the large logic and memory resources.
• Multi‑channel I/O systems  Support boards requiring many parallel interfaces or numerous peripheral connections with 500 available I/Os.
• Embedded system integration  Consolidate multiple functions into a single FPGA fabric to reduce external components and simplify system design.

Unique Advantages

• Substantial logic resources: 406,720 logic elements provide the headroom to implement large-scale custom logic and parallel processing architectures.
• Significant on‑chip memory: Approximately 29.3 Mbits of embedded RAM reduces the need for external memory in many buffering and caching scenarios.
• Extensive I/O capability: 500 I/Os enable complex board-level interfacing and support for multiple simultaneous connections.
• Compact BGA packaging: 900‑FCBGA (31×31) package supports high pin count in a space-efficient surface-mount form factor.
• Design-ready power specification: Defined core supply range (970 mV–1.03 V) aids in power budgeting and regulator selection.
• RoHS compliant: Conforms to lead‑free assembly requirements for modern manufacturing workflows.

Why Choose XC7K410T-1FFG900C?

The XC7K410T-1FFG900C is positioned for designs that demand large programmable logic, ample embedded memory, and broad I/O capacity within a compact FCBGA package. Its combination of logic density, on‑chip RAM, and 500 I/Os makes it suitable for integrating complex digital functions and consolidating system-level features onto a single device.

This commercial‑grade FPGA offers a clear path for scaling designs that require high resource counts and dense connectivity, delivering integration and flexibility for a wide range of embedded and board‑level applications.

Request a quote or submit an inquiry to obtain pricing and availability information for the XC7K410T-1FFG900C.