XC7K410T-1FF900I

The XC7K410T-1FF900I is an industrial-grade Kintex®-7 field programmable gate array (FPGA) IC from AMD supplied in a 900-ball FCBGA package. It delivers high logic density and substantial on-chip memory in a surface-mount format for designs requiring large programmable fabric and extensive I/O.

This device targets applications that need hundreds of thousands of logic elements, large embedded RAM, and up to 500 user I/O connections while operating across an industrial temperature range and a tightly-specified core supply window.

Key Features

• Logic Capacity  Provides 406,720 logic elements to implement complex programmable logic designs and large-scale digital functions.
• Configurable Logic Blocks  A high count of configurable logic resources (reported as logic elements) supports deep, parallel datapaths and complex state machines.
• Embedded Memory  Approximately 29.3 Mbits of on-chip RAM for buffering, lookup tables, and local data storage without external memory.
• I/O Density  Up to 500 user I/O pins to interface with a wide range of peripherals, sensors, and external devices.
• Power Supply Range  Core voltage specified from 970 mV to 1.03 V to match system power design and regulator selection.
• Package & Mounting  900‑ball FCBGA package (900-FCBGA, 31×31) in a surface-mount form factor for compact board-level integration.
• Operating Temperature  Industrial temperature range from −40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance  RoHS-compliant manufacturing to meet common regulatory and assembly requirements.

Typical Applications

• Communications Infrastructure  Implements high-density packet processing, protocol handling, and interface bridging where abundant logic and I/O are required.
• Data Acceleration  Hosts custom acceleration kernels and on-chip buffering using the large logic fabric and embedded RAM to offload compute tasks.
• Industrial Control  Serves motor control, automation, and process-control systems that benefit from deterministic, programmable logic operating across an industrial temperature range.
• Test & Measurement  Enables custom signal conditioning, data capture, and real-time processing with high I/O count and significant on-chip memory.

Unique Advantages

• High Logic Density: 406,720 logic elements allow consolidation of multiple functions into a single FPGA, reducing board-level component count.
• Substantial Embedded Memory: Approximately 29.3 Mbits of on-chip RAM minimizes dependency on external memory for many buffering and LUT requirements.
• Large I/O Count: Up to 500 user I/Os provide flexibility for complex interfaces and multi-channel connectivity without board redesign.
• Industrial Temperature Rating: Rated from −40 °C to 100 °C for reliable operation in harsh or temperature-variable environments.
• Compact High-Pin Package: 900-FCBGA (31×31) enables high integration in space-constrained designs while supporting extensive I/O and power distribution.
• RoHS Compliant: Meets common environmental and assembly standards to simplify manufacturing and regulatory workflows.

Why Choose XC7K410T-1FF900I?

The XC7K410T-1FF900I positions itself as a high-density, industrial-grade programmable platform for designs that demand large logic capacity, significant on-chip RAM, and a high number of I/O connections. Its specified core voltage window and surface-mount 900-FCBGA package support compact system integration and predictable power design.

This device suits engineering teams building communications, acceleration, industrial control, or measurement systems that require scalable programmable logic, local memory resources, and operation across an extended temperature range—delivering design consolidation and deployment robustness.

Request a quote or submit your pricing inquiry today to check current availability and lead times for the XC7K410T-1FF900I.