XC7K410T-1FBG900C

The XC7K410T-1FBG900C is a Kintex®-7 Field Programmable Gate Array (FPGA) from AMD offering high logic capacity and substantial on-chip memory in a 900-ball FCBGA package. It provides approximately 406,720 logic elements, roughly 29.3 Mbits of embedded memory, and 500 I/O pins for dense, I/O-rich designs.

Designed for commercial-grade applications, this surface-mount FPGA operates from a core supply range of 0.970 V to 1.030 V and across an operating temperature range of 0 °C to 85 °C, with RoHS compliance for environmental adherence.

Key Features

• Core Logic — Approximately 406,720 logic elements to implement large programmable logic and complex digital functions.
• Embedded Memory — Approximately 29.3 Mbits of on-chip RAM for buffering, state storage, and local data processing.
• I/O Density — 500 user I/O pins enabling wide peripheral connectivity and parallel interfaces.
• Power — Core voltage supply specified from 0.970 V to 1.030 V to match system power design requirements.
• Package & Mounting — 900-ball FCBGA package (900-FCBGA, 31×31) in a surface-mount form factor for PCB assembly.
• Temperature & Grade — Commercial-grade device rated for 0 °C to 85 °C operation.
• Environmental Compliance — RoHS compliant for reduced hazardous substances.

Typical Applications

• High-density logic designs — Implement large state machines, complex control logic, or custom datapaths using the ~406,720 logic elements.
• On-chip buffering and memory-centric functions — Use the approximately 29.3 Mbits of embedded memory for local buffering, FIFOs, and data staging.
• I/O-heavy systems — Leverage 500 I/O pins for multi-channel interfaces, parallel buses, or extensive peripheral connectivity.

Unique Advantages

• High logic capacity: Large logic element count enables consolidation of multiple functions into a single FPGA, reducing external component count.
• Substantial on-chip memory: Approximately 29.3 Mbits of embedded RAM supports data-intensive logic without immediate dependence on external memory.
• Broad I/O support: 500 I/O pins accommodate complex interfacing requirements and multiple simultaneous signals.
• Compact surface-mount package: 900-FCBGA (31×31) provides a high-density package footprint suitable for space-constrained PCBs.
• Commercial temperature rating: Specified operation from 0 °C to 85 °C for standard commercial deployments.
• Regulatory compliance: RoHS compliant to meet common environmental requirements.

Why Choose XC7K410T-1FBG900C?

The XC7K410T-1FBG900C positions itself as a high-capacity Kintex-7 FPGA option for designers needing significant logic and embedded memory in a single, surface-mount device. Its combination of approximately 406,720 logic elements, ~29.3 Mbits of on-chip RAM, and 500 I/Os makes it suitable for consolidating complex digital functions and reducing board-level BOM in commercial applications.

Manufactured by AMD and delivered in a 900-FCBGA package, this device offers a balance of integration, I/O density, and commercial-grade temperature performance for engineers focused on scalable, high-density programmable logic solutions.

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