XC7K410T-1FFG676C

The XC7K410T-1FFG676C is a Kintex®-7 FPGA offering a high density of programmable logic and on-chip memory in a 676-FCBGA (27×27) package. It provides 406,720 logic cells and approximately 29.3 Mbits of embedded RAM, along with up to 400 I/O pins, making it suitable for designs that require substantial logic capacity and memory on a single commercial-grade device.

With a supply voltage range of 0.97 V to 1.03 V and an operating temperature range of 0 °C to 85 °C, this surface-mount FPGA is RoHS compliant and intended for commercial applications that need scalable logic, abundant I/O, and integrated memory resources.

Key Features

• Core Logic 406,720 logic cells enabling large-scale programmable logic integration in a single device.
• Embedded Memory Approximately 29.3 Mbits of on-chip RAM to support buffer, FIFO, and memory-intensive designs.
• I/O Capacity Up to 400 I/O pins to accommodate multi-channel interfaces and high-density connectivity.
• Package & Mounting 676-BBGA (676-FCBGA, 27×27) surface-mount package for compact board-level integration.
• Power Core supply voltage range specified at 0.97 V to 1.03 V for precise power planning.
• Operating Range & Grade Commercial temperature range of 0 °C to 85 °C and commercial-grade qualification for standard electronic applications.
• Environmental Compliance RoHS compliant for lead-free manufacturing and regulatory alignment.

Typical Applications

• Data Processing and Acceleration Large logic capacity and embedded RAM support custom data-paths, buffering, and hardware acceleration functions.
• Multi-channel I/O Aggregation High pin count enables aggregation and routing of numerous digital interfaces on a single FPGA.
• Prototyping and System Integration High-density logic and memory in a compact package are suitable for consolidating functions during development and integration.

Unique Advantages

• High Logic Density: 406,720 logic cells allow implementation of complex designs without partitioning across multiple devices.
• Substantial On-chip Memory: Approximately 29.3 Mbits of embedded RAM reduce external memory requirements and simplify board design.
• Generous I/O Resources: Up to 400 I/Os support extensive peripheral and interface connectivity directly from the FPGA.
• Compact, Industry-standard Package: 676-FCBGA (27×27) provides a compact footprint for space-constrained boards while enabling high-density routing.
• Design-ready Power Spec: A defined core voltage range (0.97 V–1.03 V) helps streamline power-supply design and validation.
• Compliance and Procurement Confidence: RoHS compliance and commercial-grade specification simplify sourcing and regulatory considerations for non-industrial products.

Why Choose XC7K410T-1FFG676C?

The XC7K410T-1FFG676C positions itself as a high-capacity Kintex®-7 FPGA that balances abundant programmable logic, sizable embedded memory, and extensive I/O in a single commercial-grade, surface-mount package. Its specification set—406,720 logic cells, approximately 29.3 Mbits of on-chip RAM, and up to 400 I/Os—makes it well suited to designers consolidating complex digital functions into one device while maintaining a compact board footprint.

This device is appropriate for development teams and OEMs building memory- and logic-intensive commercial applications that require scalable logic integration, robust on-chip memory, and clear power and temperature parameters. RoHS compliance and the 676-FCBGA package facilitate integration into modern manufacturing flows and dense PCB designs.

Request a quote or submit an inquiry to evaluate the XC7K410T-1FFG676C for your next design and to get pricing and availability information.