XC7K160T-1FF676C

The XC7K160T-1FF676C is a Kintex®-7 field programmable gate array (FPGA) from AMD supplied in a 676‑ball FCBGA surface-mount package. It combines a large logic capacity with substantial on-chip memory and a broad I/O count to address complex, customizable digital designs.

With 162,240 logic elements, approximately 11.98 Mbits of embedded memory and 400 user I/O, this commercial‑grade FPGA is suited to board‑level systems that require high integration in a compact package while operating within a 0 °C to 85 °C temperature range and a core supply window of 0.97–1.03 V.

Key Features

• Core Logic — 162,240 logic elements provide substantial capacity for implementing complex custom logic and parallel processing chains; the device lists 12,675 CLBs for logic block reference.
• Embedded Memory — Approximately 11.98 Mbits of on‑chip RAM for buffering, packet storage, lookup tables and other memory‑centric functions.
• I/O Density — 400 user I/O pins enable broad peripheral interfacing and multiple external connections on a single device.
• Power — Specified core supply range of 0.97 V to 1.03 V to align with board power budgeting and regulator selection.
• Package & Mounting — 676‑BBGA (676‑FCBGA, 27×27) surface‑mount package supports compact, high‑density board layouts.
• Operating Conditions — Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance for environmental regulatory alignment.

Typical Applications

• Custom Digital Processing — Implement application‑specific logic and parallel compute functions using the device’s 162,240 logic elements and 12,675 CLBs.
• Memory‑Intensive Designs — Use approximately 11.98 Mbits of embedded RAM for data buffering, packet queues or on‑chip storage to reduce external memory dependence.
• I/O‑Rich Systems — Integrate multiple peripherals, sensors or interfaces on a single FPGA thanks to 400 configurable user I/O pins.
• Compact Board Designs — The 676‑ball FCBGA surface‑mount package supports dense, space‑constrained PCBs where board real estate is limited.

Unique Advantages

• High Logic Capacity: 162,240 logic elements enable implementation of sizeable custom logic blocks without partitioning across multiple devices.
• Substantial On‑Chip Memory: Approximately 11.98 Mbits of embedded RAM helps minimize external memory needs and simplify board design.
• Robust I/O Count: 400 user I/O pins provide flexibility for multi‑interface designs and extensive peripheral connectivity.
• Compact, Surface‑Mount Package: 676‑FCBGA (27×27) packaging supports high‑density PCB layouts while keeping the solution surface‑mount compatible.
• Commercial Temperature Rating: 0 °C to 85 °C operation fits a wide range of standard commercial applications and deployment environments.
• Regulatory Compliance: RoHS compliance supports regulatory and environmental requirements for many product lines.

Why Choose XC7K160T-1FF676C?

The XC7K160T-1FF676C positions itself as a high‑capacity programmable logic device for commercial applications that require a balance of extensive logic resources, embedded memory and comprehensive I/O in a compact surface‑mount package. Its specification set — including 162,240 logic elements, roughly 11.98 Mbits of on‑chip RAM, 400 I/O and a 676‑ball FCBGA package — makes it well suited to mid‑to‑high complexity designs where on‑board integration and reduced external components are priorities.

Backed by AMD’s Kintex®‑7 product lineage and RoHS compliance, this part is appropriate for customers building scalable, maintainable designs within standard commercial temperature ranges who need a programmable solution with significant on‑chip resources.

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