XC7K160T-1FBG484I

IC FPGA 285 I/O 484FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 11980800 162240 484-BBGA, FCBGA

Quantity 1,121 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package484-FCBGA (23x23)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case484-BBGA, FCBGANumber of I/O285Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-1FBG484I – Kintex®-7 FPGA, 162,240 Logic Elements, 484‑FCBGA

The XC7K160T-1FBG484I is a Kintex®-7 field programmable gate array (FPGA) supplied in a 484‑ball FCBGA package. It provides a high-density programmable logic platform with substantial embedded memory and a broad I/O count, targeted for industrial-grade electronic systems.

Designed for applications requiring significant on-chip logic and versatile interfacing, this device combines 162,240 logic elements, approximately 11.98 Mbits of embedded RAM, and 285 user I/Os in a surface-mount 484‑FCBGA (23×23) package while supporting an industrial operating temperature range.

Key Features

  • Programmable Logic Density  162,240 logic elements provide capacity for complex custom logic, state machines, and data-path implementations.
  • Embedded Memory  Approximately 11.98 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
  • I/O Resources  285 general-purpose I/Os enable wide external connectivity for interfaces, peripherals, and system-level integration.
  • Package and Mounting  484‑ball FCBGA (23×23) surface-mount package suitable for compact board designs requiring high pin density.
  • Power Supply  Core supply range from 0.970 V to 1.03 V for the device core voltage domain.
  • Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C to meet a range of industrial temperature requirements.
  • RoHS Compliant  Manufactured in compliance with RoHS environmental requirements.

Typical Applications

  • Industrial Control and Automation  Use the device’s logic density and I/O count to implement custom control logic, data aggregation, and I/O interfacing for automated equipment.
  • High‑Density Digital Systems  Implement complex digital signal paths and protocol logic using the available logic elements and on-chip RAM for buffering and processing.
  • Embedded System Prototyping  Leverage the large programmable fabric and plentiful I/Os to prototype and validate system architectures before production.

Unique Advantages

  • High Logic Integration: 162,240 logic elements enable consolidation of multiple functions onto a single device, reducing BOM and board complexity.
  • Substantial On‑Chip Memory: Approximately 11.98 Mbits of embedded RAM supports local buffering and data processing without external memory.
  • Extensive I/O Count: 285 I/Os provide flexibility for interfacing to sensors, peripherals, and multi-channel I/O assemblies.
  • Industrial Temperature Support: Qualified for −40 °C to 100 °C operation to suit demanding environmental conditions.
  • Compact High‑Pin Package: 484‑FCBGA (23×23) package delivers high pin density in a compact footprint for space-constrained PCBs.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious designs and regulatory adherence.

Why Choose XC7K160T-1FBG484I?

The XC7K160T-1FBG484I positions itself as a high-capacity, industrial-grade Kintex®-7 FPGA that balances logic density, embedded memory, and I/O flexibility in a compact FCBGA package. Its specifications—162,240 logic elements, approximately 11.98 Mbits of embedded RAM, 285 I/Os, and a −40 °C to 100 °C operating range—make it suitable for complex, space-constrained designs requiring robust operation across industrial temperatures.

Choose this device when your design demands substantial on-chip resources and reliable operation in industrial environments while preserving board area with a 484‑ball FCBGA footprint.

Request a quote or submit an inquiry to obtain pricing and availability for XC7K160T-1FBG484I. Our team will provide the information needed to move your design forward.

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