XC7K160T-1FBG484I
| Part Description |
Kintex®-7 Field Programmable Gate Array (FPGA) IC 285 11980800 162240 484-BBGA, FCBGA |
|---|---|
| Quantity | 1,121 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FCBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA, FCBGA | Number of I/O | 285 | Voltage | 970 mV - 1.03 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 12675 | Number of Logic Elements/Cells | 162240 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 11980800 |
Overview of XC7K160T-1FBG484I – Kintex®-7 FPGA, 162,240 Logic Elements, 484‑FCBGA
The XC7K160T-1FBG484I is a Kintex®-7 field programmable gate array (FPGA) supplied in a 484‑ball FCBGA package. It provides a high-density programmable logic platform with substantial embedded memory and a broad I/O count, targeted for industrial-grade electronic systems.
Designed for applications requiring significant on-chip logic and versatile interfacing, this device combines 162,240 logic elements, approximately 11.98 Mbits of embedded RAM, and 285 user I/Os in a surface-mount 484‑FCBGA (23×23) package while supporting an industrial operating temperature range.
Key Features
- Programmable Logic Density 162,240 logic elements provide capacity for complex custom logic, state machines, and data-path implementations.
- Embedded Memory Approximately 11.98 Mbits of on-chip RAM to support buffering, FIFOs, and on-chip data storage for high-throughput designs.
- I/O Resources 285 general-purpose I/Os enable wide external connectivity for interfaces, peripherals, and system-level integration.
- Package and Mounting 484‑ball FCBGA (23×23) surface-mount package suitable for compact board designs requiring high pin density.
- Power Supply Core supply range from 0.970 V to 1.03 V for the device core voltage domain.
- Industrial Temperature Grade Rated for operation from −40 °C to 100 °C to meet a range of industrial temperature requirements.
- RoHS Compliant Manufactured in compliance with RoHS environmental requirements.
Typical Applications
- Industrial Control and Automation Use the device’s logic density and I/O count to implement custom control logic, data aggregation, and I/O interfacing for automated equipment.
- High‑Density Digital Systems Implement complex digital signal paths and protocol logic using the available logic elements and on-chip RAM for buffering and processing.
- Embedded System Prototyping Leverage the large programmable fabric and plentiful I/Os to prototype and validate system architectures before production.
Unique Advantages
- High Logic Integration: 162,240 logic elements enable consolidation of multiple functions onto a single device, reducing BOM and board complexity.
- Substantial On‑Chip Memory: Approximately 11.98 Mbits of embedded RAM supports local buffering and data processing without external memory.
- Extensive I/O Count: 285 I/Os provide flexibility for interfacing to sensors, peripherals, and multi-channel I/O assemblies.
- Industrial Temperature Support: Qualified for −40 °C to 100 °C operation to suit demanding environmental conditions.
- Compact High‑Pin Package: 484‑FCBGA (23×23) package delivers high pin density in a compact footprint for space-constrained PCBs.
- Regulatory Compliance: RoHS compliance supports environmentally conscious designs and regulatory adherence.
Why Choose XC7K160T-1FBG484I?
The XC7K160T-1FBG484I positions itself as a high-capacity, industrial-grade Kintex®-7 FPGA that balances logic density, embedded memory, and I/O flexibility in a compact FCBGA package. Its specifications—162,240 logic elements, approximately 11.98 Mbits of embedded RAM, 285 I/Os, and a −40 °C to 100 °C operating range—make it suitable for complex, space-constrained designs requiring robust operation across industrial temperatures.
Choose this device when your design demands substantial on-chip resources and reliable operation in industrial environments while preserving board area with a 484‑ball FCBGA footprint.
Request a quote or submit an inquiry to obtain pricing and availability for XC7K160T-1FBG484I. Our team will provide the information needed to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
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Certifications and Memberships: ISO9001:2015, RoHS, REACH








