XC7K160T-1FB676I

The XC7K160T-1FB676I is a Kintex®-7 Field Programmable Gate Array (FPGA) manufactured by AMD, delivered in a 676-FCBGA (27×27) surface-mount package. It provides substantial on-chip resources including 162,240 logic elements, approximately 12 Mbits of embedded memory, and 400 user I/O pins.

Rated for industrial use with an operating temperature range of −40 °C to 100 °C and a core supply range of 970 mV to 1.03 V, this device targets designs that require high integration density, significant on-chip memory, and robust temperature tolerance.

Key Features

• Core Logic 162,240 logic elements for implementing complex digital logic and customized hardware acceleration.
• Embedded Memory Approximately 11.98 Mbits of on-chip RAM to support buffering, lookup tables, and state storage close to logic.
• I/O Capacity 400 I/O pins to interface with multiple peripherals, buses, and external components without immediate external multiplexing.
• Package & Mounting 676-FCBGA (27×27) package in a surface-mount format for high-pin-count board designs and compact footprint.
• Power Core supply specification from 0.97 V to 1.03 V to match tight power-supply requirements in system designs.
• Temperature & Grade Industrial grade device with an operating range of −40 °C to 100 °C for deployment in thermally demanding environments.
• Compliance RoHS-compliant to satisfy common environmental and manufacturing requirements.

Typical Applications

• Logic-dense systems Implement complex finite-state machines, custom datapaths, or hardware accelerators using the device’s large logic element count.
• Memory-centric functions Use the approximately 12 Mbits of embedded memory for buffering, packet storage, or lookup operations that benefit from on-chip RAM.
• I/O-rich interfaces The 400 I/O pins support integration with multiple sensors, mezzanine cards, or multi-channel I/O requirements without extensive external multiplexing.
• Industrial equipment Industrial-grade temperature range and RoHS compliance make the device suitable for control, instrumentation, and industrial communication systems.

Unique Advantages

• High integration density: 162,240 logic elements reduce the need for discrete components and simplify board-level design.
• Substantial on-chip memory: Approximately 11.98 Mbits of embedded RAM enable local data storage and high-bandwidth buffering.
• Extensive I/O connectivity: 400 I/O pins provide flexibility to connect multiple peripherals and interfaces directly to the FPGA.
• Industrial temperature support: −40 °C to 100 °C operating range supports deployment in harsh thermal environments.
• Compact, high-pin-count package: 676-FCBGA (27×27) surface-mount package balances pin density with a manageable PCB footprint.
• Environmental compliance: RoHS compliant to meet regulatory and manufacturing requirements.

Why Choose XC7K160T-1FB676I?

The XC7K160T-1FB676I combines substantial logic capacity, on-chip memory, and a high I/O count in a robust, industrial-grade FPGA package from AMD. Its specified core voltage range and wide operating temperature make it suited for designs that require reliable operation under varied power and thermal conditions.

This device is well suited for engineering teams building high-density digital systems that need integrated memory and extensive I/O without excessive external components. The combination of performance-oriented resources and industrial-grade specifications delivers a scalable platform for long-term deployments.

Request a quote or submit an inquiry to obtain pricing and availability information for XC7K160T-1FB676I.