XC7K160T-1FBG676I

The XC7K160T-1FBG676I is a Kintex®-7 field programmable gate array (FPGA) IC from AMD, supplied in a 676-FCBGA (27×27) package. It provides high logic density with 162,240 logic elements, approximately 11.98 Mbits of embedded memory, and 400 user I/Os for integration into complex digital systems.

Designed for industrial temperature environments, this surface-mount FPGA operates across a core supply range of 970 mV to 1.03 V and an operating temperature range of −40 °C to 100 °C, making it suitable for designs that require dense logic resources, on-chip RAM, and robust I/O capacity.

Key Features

• Logic Capacity — 162,240 logic elements to implement large-scale digital designs and custom hardware accelerators.
• Embedded Memory — Approximately 11.98 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
• I/O Count — 400 I/Os for extensive external interfacing and flexible connectivity in high-pin-count applications.
• Package & Mounting — 676-FCBGA (27×27) supplier device package, surface-mount case (676-BBGA, FCBGA) for compact board integration.
• Power — Core voltage supply range from 970 mV to 1.03 V to match system power architectures.
• Temperature Range — Industrial operating range from −40 °C to 100 °C for deployment in temperature-challenging environments.
• Environmental Compliance — RoHS compliant.

Typical Applications

• High-density digital processing — Implement complex logic functions and custom datapaths using the 162,240 logic elements and on-chip RAM.
• Embedded system integration — Combine abundant I/Os and embedded memory to interface sensors, peripherals, and local buffering in compact designs.
• Prototyping and FPGA-based acceleration — Use the device’s capacity for rapid hardware prototyping and development of acceleration engines requiring substantial logic and RAM.

Unique Advantages

• Substantial logic density: 162,240 logic elements enable implementation of complex, high-function-count designs without immediate migration to larger packages.
• On-chip memory availability: Approximately 11.98 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage needs.
• High I/O count: 400 I/Os simplify board-level connectivity and allow flexible interface choices without extensive multiplexing.
• Industrial temperature support: Specified operation from −40 °C to 100 °C supports deployment in demanding thermal environments.
• Compact package: 676-FCBGA (27×27) provides a high-pin-count solution in a compact footprint for space-constrained PCBs.
• Regulatory compliance: RoHS compliance assists with environmental and supply-chain requirements.

Why Choose XC7K160T-1FBG676I?

The XC7K160T-1FBG676I strikes a balance between logic capacity, embedded memory, and I/O availability in a compact 676-FCBGA package. It is positioned for designers who need substantial on-chip resources—162,240 logic elements and approximately 11.98 Mbits of RAM—alongside 400 I/Os and industrial temperature capability.

This FPGA is well suited for teams developing complex digital systems, hardware accelerators, and embedded solutions where integration density, thermal range, and board-level I/O flexibility are key selection criteria. Its specifications support scalable designs and help streamline system architecture by reducing external component needs.

Request a quote or submit a procurement inquiry to receive pricing and availability for the XC7K160T-1FBG676I.