XC7K160T-1FF676I

IC FPGA 400 I/O 676FCBGA
Part Description

Kintex®-7 Field Programmable Gate Array (FPGA) IC 400 11980800 162240 676-BBGA, FCBGA

Quantity 252 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package676-FCBGA (27x27)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case676-BBGA, FCBGANumber of I/O400Voltage970 mV - 1.03 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs12675Number of Logic Elements/Cells162240
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits11980800

Overview of XC7K160T-1FF676I – Kintex®-7 Field Programmable Gate Array (FPGA)

The XC7K160T-1FF676I is a Kintex®-7 FPGA IC from AMD designed for industrial-grade programmable logic applications. It delivers a large logic capacity, embedded memory, and extensive I/O in a 676‑ball FCBGA package, making it suitable for systems that require customizable digital logic and robust environmental range.

This device targets use in applications that need significant on-chip resources and flexible interfacing, offering a balance of integration and system-level configurability through its available logic elements, embedded RAM, and 400 I/O pins.

Key Features

  • Logic Capacity — Contains 162,240 logic elements, enabling substantial programmable logic for complex designs and custom hardware acceleration.
  • Embedded Memory — Approximately 12 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory.
  • I/O Density — 400 available I/O pins to support broad peripheral interfacing and multi-channel connectivity.
  • Package — 676‑BBGA (676‑FCBGA, 27×27) surface-mount package that provides a compact, high-pin-count footprint.
  • Power Supply — Core voltage range of 0.970 V to 1.03 V to match system power-rail planning and regulator selection.
  • Industrial Temperature Range — Rated for operation from −40 °C to 100 °C to meet many industrial environmental requirements.
  • RoHS Compliant — Conforms to RoHS requirements for lead-free manufacturing processes.

Typical Applications

  • Industrial Control — Use the device’s industrial temperature rating and 400 I/O to interface sensors, actuators, and control buses in factory automation and process control systems.
  • Communications and Networking — Leverage large logic capacity and embedded memory to implement custom packet processing, protocol bridging, and I/O aggregation functions.
  • Data Acquisition and Test Equipment — High I/O count and on-chip RAM support multi-channel sampling, preprocessing, and real-time data buffering for measurement systems.
  • Embedded System Prototyping — Programmable logic and abundant resources make the device suitable for developing and validating custom accelerators and digital subsystems.

Unique Advantages

  • Substantial Logic Resources: 162,240 logic elements provide headroom for complex custom logic, enabling consolidation of multiple functions into a single device.
  • On-Chip Memory: Approximately 12 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs, simplifying BOM and board layout.
  • High I/O Count: 400 I/O pins support extensive peripheral connections and multi-channel interfaces without additional multiplexing hardware.
  • Industrial Operating Range: Rated operation from −40 °C to 100 °C for deployment in environments with wide temperature variation.
  • Compact High‑Pin Package: 676‑FCBGA (27×27) package packs a large feature set into a space-saving surface-mount footprint suitable for dense system boards.
  • RoHS Compliance: Meets environmental manufacturing standards for lead-free assembly.

Why Choose XC7K160T-1FF676I?

The XC7K160T-1FF676I combines a significant logic element count, substantial embedded RAM, and a high I/O complement in an industrial-grade, compact 676‑FCBGA package. Its specified supply voltage range and wide operating temperature make it a dependable choice where system integration and environmental resilience are required.

This part is well suited for engineers and system designers building industrial control systems, communications equipment, data acquisition platforms, and advanced prototyping projects that need programmable, high-density logic with on-chip memory and robust I/O capability. Its measured specifications support scalable designs and long-term deployment in demanding environments.

Request a quote or submit a purchase inquiry to evaluate XC7K160T-1FF676I for your next programmable-logic design.

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