XC7A75T-L2CSG324E

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 210 3870720 75520 324-LFBGA, CSPBGA

Quantity 1,008 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeExtendedOperating Temperature0°C – 100°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3870720

Overview of XC7A75T-L2CSG324E – Artix-7 Field Programmable Gate Array (324-LFBGA)

The XC7A75T-L2CSG324E is an Artix-7 Field Programmable Gate Array (FPGA) IC provided in a 324-pin LFBGA/CSPBGA package. It delivers programmable logic resources, embedded memory, and a high count of I/O for designs that require flexible hardware implementation within an extended-grade temperature range.

Key measurable attributes include 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and 210 user I/O pins, with a core supply range of 0.95 V to 1.05 V and an operating temperature range of 0 °C to 100 °C.

Key Features

  • Logic Capacity — 75,520 logic elements provide substantial programmable logic resources for complex custom logic and routing.
  • Embedded Memory — Approximately 3.87 Mbits of on-chip RAM to support buffering, state machines, and local data storage.
  • I/O Count — 210 user I/O pins to accommodate multiple parallel interfaces and peripheral connections.
  • Power Supply — Core voltage supply specified from 0.95 V to 1.05 V for device operation.
  • Package and Mounting — Supplied in a 324-LFBGA (324-CSPBGA, 15×15) package designed for surface-mount assembly.
  • Temperature Grade — Extended grade operation with a specified operating range of 0 °C to 100 °C.
  • Standards Compliance — RoHS compliant, meeting common environmental material requirements.

Typical Applications

  • Custom Logic and Prototyping — Deploys 75,520 logic elements and on-chip RAM for implementing and iterating custom digital circuits and prototypes.
  • High-Density I/O Control — 210 user I/O pins support multi-channel interfacing for control and data acquisition tasks.
  • Embedded Memory-Dependent Functions — Approximately 3.87 Mbits of embedded memory enable local buffering, packet staging, and state retention.
  • Surface-Mount PCB Designs — 324-LFBGA packaging and surface-mount mounting suit modern PCB assembly workflows with compact footprint requirements.

Unique Advantages

  • Substantial Logic Resources: 75,520 logic elements allow implementation of complex finite-state machines, custom datapaths, and combinational logic without external CPLDs.
  • Integrated Memory Capacity: Approximately 3.87 Mbits of on-chip RAM reduces dependence on external memory for many buffering and local storage needs.
  • Large I/O Complement: 210 I/O pins provide flexibility for connecting multiple peripherals, sensors, or parallel interfaces directly to the FPGA.
  • Compact, Surface-Mount Package: The 324-CSPBGA (15×15) package offers a high pin-count solution in a compact footprint compatible with surface-mount assembly processes.
  • Extended Operating Range: Rated for 0 °C to 100 °C operation, suitable for systems requiring extended-grade temperature performance.
  • Regulatory Compliance: RoHS compliance supports designs targeting restricted-substance requirements.

Why Choose XC7A75T-L2CSG324E?

The XC7A75T-L2CSG324E combines a substantial logic element count, significant on-chip memory, and a high I/O count in a compact 324-LFBGA surface-mount package, making it a practical choice for designs that demand programmable hardware capacity with a measurable resource profile. Its extended-grade operating range and RoHS compliance further align it with applications that require reliable operation across a defined temperature window and adherence to material regulations.

This part is well suited to teams and projects that need a clearly specified mid-range FPGA resource set and a compact package form factor, with manufacturer documentation available to support integration and implementation decisions.

Request a quote or submit a request for pricing and availability to obtain lead-time and ordering information for the XC7A75T-L2CSG324E.

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