XC7A75T-3CSG324E

The XC7A75T-3CSG324E is an Artix-7 family FPGA in a 324-pin LFBGA/CSPBGA package designed for surface-mount PCB integration. It provides 75,520 logic elements, approximately 3.87 Mbits of on-chip RAM, and 210 user I/O to support complex programmable logic tasks.

With an extended-grade temperature range of 0°C to 100°C, a core voltage supply range of 0.95 V to 1.05 V, and RoHS compliance, this device targets designs that require substantial logic capacity, embedded memory, and a high count of I/O in a compact CSPBGA footprint.

Key Features

• Core Logic  Provides 75,520 logic elements to implement large-scale custom digital functions and parallel processing pipelines.
• Embedded Memory  Approximately 3.87 Mbits of on-chip RAM for buffering, state storage, and data-path implementations without immediate external memory dependence.
• I/O Capacity  210 user I/O pins suitable for interfacing with multiple peripherals, sensors, and high-pin-count interfaces.
• Package & Mounting  324-LFBGA / 324-CSPBGA (15×15) package in a surface-mount form factor for dense PCB layouts and automated assembly.
• Power  Core voltage supply range of 0.95 V to 1.05 V to align with target system power rails and enable predictable power budgeting.
• Temperature & Grade  Extended-grade device rated for operation from 0°C to 100°C for applications with moderate thermal requirements.
• Regulatory  RoHS compliant.

Typical Applications

• Custom digital logic and prototyping  Implement complex state machines, signal processing blocks, and custom accelerators using 75,520 logic elements and on-chip RAM.
• Multi-I/O interface hubs  Aggregate and manage numerous peripheral interfaces or sensor inputs using the device's 210 user I/O pins.
• Embedded system integration  Compact 324-CSPBGA package enables high-density board designs where surface-mount assembly and board space efficiency are required.

Unique Advantages

• High logic capacity: 75,520 logic elements allow substantial on-chip computation and complex design partitioning without immediate reliance on external processors.
• Significant embedded memory: Approximately 3.87 Mbits of RAM supports buffering, FIFOs, and local data storage to simplify external memory requirements.
• Large I/O complement: 210 user I/O pins provide flexibility to connect many peripherals and parallel interfaces directly to the FPGA fabric.
• Compact, manufacturable package: 324-CSPBGA (15×15) surface-mount package supports automated PCB assembly and dense board layouts.
• Predictable power envelope: Defined core voltage range of 0.95–1.05 V helps with power supply selection and system-level power planning.
• Extended temperature support: 0°C to 100°C operating range suits applications with moderate thermal environments.

Why Choose XC7A75T-3CSG324E?

The XC7A75T-3CSG324E combines substantial logic resources, meaningful on-chip memory, and a high I/O count in a compact 324-pin CSPBGA package. It is well suited for engineers who need a programmable, high-density logic solution that balances integration and board-level manufacturability.

This device is aimed at designs that require scalable logic capacity, flexible I/O connectivity, and a predictable supply and thermal envelope. RoHS compliance and extended-grade operation contribute to reliable, long-term deployment in a range of embedded applications.

Request a quote or submit an inquiry to receive pricing and availability for the XC7A75T-3CSG324E and to discuss how this Artix-7 FPGA can fit into your next design.