XC7A75T-3FGG676E

The XC7A75T-3FGG676E is an Artix‑7 family Field Programmable Gate Array (FPGA) in a 676‑FBGA package, delivering a substantial programmable logic resource set and on‑chip memory for embedded designs. This device combines a high logic element count, multi‑megabit embedded RAM, and a large I/O complement to address designs that require flexible, reconfigurable hardware.

With extended grade operation and a surface‑mount 676‑BGA package, the device is suited to applications that need significant logic capacity alongside controlled supply and temperature conditions defined by the device specifications.

Key Features

• Logic Capacity — 75,520 logic elements provide abundant programmable fabric for complex custom logic implementations.
• Embedded Memory — Approximately 3.9 Mbits of on‑chip RAM (total RAM bits: 3,870,720) for buffering, state storage, and memory‑intensive functions.
• I/O Resources — Up to 300 user I/Os to support dense external interfacing and multiple parallel connections.
• Power Supply — Core voltage support from 950 mV to 1.05 V to match system power rail requirements.
• Package and Mounting — 676‑FBGA (27x27) supplier device package and 676‑BGA package case with surface mount assembly.
• Operating Range — Extended grade operating temperature from 0 °C to 100 °C.
• Compliance — RoHS compliant for materials and environmental considerations.

Typical Applications

• High‑density digital systems — Use the 75,520 logic elements to implement complex control, processing, or glue logic in FPGA‑based subsystems.
• Memory‑centric designs — Approximately 3.9 Mbits of embedded RAM supports buffering, packet storage, and on‑chip data structures.
• I/O‑intensive interfaces — 300 I/Os enable broad connectivity for parallel sensor arrays, external peripherals, or multi‑lane interfaces.

Unique Advantages

• Substantial programmable fabric: 75,520 logic elements let you implement large custom logic blocks without external ASICs.
• On‑chip memory capacity: Approximately 3.9 Mbits of RAM reduces dependence on external memory for many buffering and state‑holding tasks.
• High I/O count: 300 I/Os allow flexible partitioning of signals and support for multiple external interfaces in a single device.
• Compact, surface‑mount package: 676‑FBGA (27x27) balances package density with integration for space‑constrained PCBs.
• Extended temperature range: Rated for 0 °C to 100 °C operation to suit designs targeting this thermal envelope.
• RoHS compliant: Complies with RoHS requirements for environmentally conscious manufacturing.

Why Choose XC7A75T-3FGG676E?

The XC7A75T-3FGG676E positions itself as a capable Artix‑7 FPGA option for designs that require a large quantity of programmable logic, multiple megabits of embedded RAM, and a high number of I/Os in a single surface‑mount package. Its specified core voltage range and extended temperature rating allow architects to design around defined electrical and thermal constraints.

This device is well suited for engineers and procurement teams seeking a reconfigurable silicon option with measurable on‑chip resources—offering scalability in logic and memory capacity within the Artix‑7 family for medium‑to‑high density FPGA applications.

Request a quote or submit a pricing and availability inquiry to evaluate XC7A75T-3FGG676E for your next design.