XC7A75T-2FGG676I

The XC7A75T-2FGG676I is an Artix-7 Field Programmable Gate Array (FPGA) from AMD, supplied in a 676-BGA package. As a programmable logic device it provides a balance of logic capacity, embedded memory, and I/O count suitable for custom digital designs and industrial applications.

Key Features

• Logic Capacity: 75,520 logic elements (cells) organized with 5,900 configurable logic blocks (CLBs) to implement complex digital functions.
• Embedded Memory: Approximately 3.87 Mbits of on-chip RAM for data buffering, state storage, and scratchpad memory.
• I/O Resources: 300 user I/O pins to support a wide range of interfaces and parallel signals.
• Package & Mounting: 676-FBGA package (27×27 mm) in a surface-mount format for compact board integration.
• Power Supply: Core supply range of 0.95 V to 1.05 V for the device core.
• Temperature Range: Industrial operating temperature from -40 °C to 100 °C for deployment in demanding environments.
• Environmental Compliance: RoHS compliant.

Typical Applications

• Industrial Control Systems: Industrial-grade temperature rating and flexible I/O count make this FPGA suitable for control logic, protocol bridging, and real-time signal processing in factory automation.
• Embedded Digital Designs: High logic element count and on-chip RAM support custom digital functions, accelerators, and glue logic for embedded systems.
• High-Density I/O Interfaces: With 300 I/O pins and a compact 676-FBGA package, the device fits designs requiring multiple parallel interfaces or dense signal routing.

Unique Advantages

• Significant Logic Resources: 75,520 logic elements and 5,900 CLBs provide room for complex finite-state machines, datapaths, and custom accelerators.
• Substantial On-Chip Memory: Approximately 3.87 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Broad I/O Support: 300 I/O pins enable integration of multiple peripherals, sensors, and high-speed interfaces without extensive board-level multiplexing.
• Industrial Temperature Capability: Rated from -40 °C to 100 °C for reliable operation across typical industrial environments.
• Compact, Surface-Mount Package: 676-FBGA (27×27 mm) offers a high-density footprint for space-constrained boards while maintaining robust connectivity.
• Regulatory Compliance: RoHS compliance supports environmental and manufacturing requirements.

Why Choose XC7A75T-2FGG676I?

The XC7A75T-2FGG676I positions itself as a versatile, industrial-grade Artix-7 FPGA that combines substantial logic capacity, meaningful on-chip memory, and a high I/O count in a compact 676-FBGA package. These characteristics make it suitable for engineers designing embedded systems, industrial controllers, and high-density interface solutions that require programmable hardware resources and reliable operation across temperature extremes.

Its combination of logic elements, embedded RAM, and 300 I/O pins delivers a scalable platform for iterative development and long-term deployments, supported by AMD’s Artix-7 architecture documentation and design ecosystem.

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