XC7A75T-2FGG484I
| Part Description |
Artix-7 Field Programmable Gate Array (FPGA) IC 285 3870720 75520 484-BBGA |
|---|---|
| Quantity | 262 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-FBGA (23x23) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-BBGA | Number of I/O | 285 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 5900 | Number of Logic Elements/Cells | 75520 | ||
| Number of Gates | N/A | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 3870720 |
Overview of XC7A75T-2FGG484I – Artix-7 FPGA (484-BBGA), Industrial
The XC7A75T-2FGG484I is an AMD Artix-7 Field Programmable Gate Array supplied in a 484-BBGA surface-mount package. It delivers a substantial logic fabric and embedded memory in an industrial-grade device designed for applications that require configurable digital logic with extended temperature capability.
This device combines a large number of logic elements, embedded RAM, and abundant I/O while operating from a low-voltage core supply, making it suitable for a wide range of FPGA-based designs where integration and environmental robustness are required.
Key Features
- Logic Capacity — 75,520 logic elements and 5,900 configurable logic blocks (CLBs) provide ample programmable fabric for complex digital designs.
- Embedded Memory — Approximately 3.87 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
- I/O Count — 285 user I/O pins to interface with multiple peripherals and external devices.
- Power Domain — Core voltage supply range of 0.95 V to 1.05 V to match low-voltage FPGA system designs.
- Package and Mounting — 484-BBGA (supplier package: 484-FBGA, 23×23) in a surface-mount format for compact PCB integration.
- Operating Temperature — Industrial temperature range from −40 °C to 100 °C for deployment in extended-environment applications.
- Compliance — RoHS compliant.
Typical Applications
- Custom Digital Logic — Implement complex, application-specific logic functions using the device's large programmable fabric and CLB count.
- Data Buffering and Processing — Use the approximately 3.87 Mbits of embedded RAM for buffering, FIFOs, and intermediate data storage.
- Multi-Interface Systems — 285 I/O pins allow connectivity for multiple parallel or serial interfaces and external peripherals.
- Industrial and Rugged Designs — The −40 °C to 100 °C operating range supports deployment in systems exposed to wide temperature variations.
Unique Advantages
- High Logic Density: 75,520 logic elements enable implementation of sizeable digital systems without immediately scaling to larger device families.
- Substantial On-Chip Memory: Approximately 3.87 Mbits of embedded RAM reduces reliance on external memory for many buffering and state-storage needs.
- Extensive I/O: 285 I/O pins provide flexibility to connect sensors, controllers, and external interfaces directly to the FPGA.
- Industrial Temperature Rating: −40 °C to 100 °C operation supports usage in extended-environment applications where thermal range matters.
- Compact Surface-Mount Package: 484-BBGA (23×23) helps minimize PCB footprint while supporting high pin count requirements.
- Low-Voltage Core: 0.95–1.05 V supply aligns with modern low-voltage FPGA system architectures.
Why Choose XC7A75T-2FGG484I?
The XC7A75T-2FGG484I positions itself as a robust, industrial-grade Artix-7 FPGA option that balances substantial logic resources, embedded memory, and extensive I/O in a compact 484-BBGA package. Its low-voltage core and wide operating temperature range make it suitable for engineers seeking a configurable, reliable building block for demanding digital designs.
This device is well suited for development teams and OEMs that need scalable programmable logic capacity, on-chip RAM for intermediate data handling, and broad connectivity while maintaining a compact board footprint and RoHS compliance.
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