XC7A75T-1FTG256C
| Part Description |
Artix-7 FPGA, XC7A75T, 75,520 Logic Cells, 180 DSP, FTG256, Commercial |
|---|---|
| Quantity | 771 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 16 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | FTG256 | Grade | N/A | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 256-BGA | Number of I/O | 300 | Voltage | 950 mV - 1.05 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 | Number of LABs/CLBs | 47200 | Number of Logic Elements/Cells | 75520 | ||
| Number of Gates | N/A | ECCN | EAR99 | HTS Code | 8542.31.00.60 | ||
| Qualification | N/A | Total RAM Bits | 3870720 |
Overview of XC7A75T-1FTG256C – Artix-7 Field Programmable Gate Array, 256-LBGA
The XC7A75T-1FTG256C is an Artix-7 Field Programmable Gate Array (FPGA) IC offered in a 256-pin LBGA package. It provides a balance of programmable logic capacity, on-chip memory and I/O density for designs that require configurable hardware resources within a commercial temperature range.
Key capabilities include 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and 170 user I/O pins. The device operates from a core supply range of 0.95 V to 1.05 V and is RoHS compliant.
Key Features
- Core Logic — 75,520 logic elements for implementing custom digital logic, state machines and accelerators.
- Embedded Memory — Approximately 3.87 Mbits of on-chip RAM to support buffering, FIFOs, and local data storage without external memory.
- I/O Density — 170 user I/O pins to support multiple interfaces and signal routing requirements.
- Power Supply — Core voltage supply range from 0.95 V to 1.05 V to match specified core power domains.
- Package & Mounting — 256-LBGA, supplier package 256-FTBGA (17×17) in a surface-mount form factor for compact system integration.
- Operating Grade & Temperature — Commercial grade with an operating temperature range of 0 °C to 85 °C.
- Regulatory Compliance — RoHS compliant for environmental and manufacturing considerations.
Typical Applications
- Custom Logic and Acceleration — Implement hardware accelerators and application-specific logic using up to 75,520 logic elements and embedded RAM to offload compute from a host CPU.
- I/O Expansion and Protocol Bridging — Use the 170 I/O pins to bridge or aggregate multiple serial and parallel interfaces in a single programmable device.
- Embedded System Prototyping — Rapidly prototype complex digital designs that require on-chip memory and flexible I/O without committing to ASIC development.
Unique Advantages
- Significant Logic Capacity: 75,520 logic elements enable complex designs and the integration of multiple functions into a single device, reducing external components.
- On-Chip Memory: Approximately 3.87 Mbits of embedded RAM minimizes dependence on external memory for buffering and local storage, simplifying board design.
- High I/O Count: 170 I/O pins provide flexibility to connect to many peripherals and interfaces directly from the FPGA.
- Compact Surface-Mount Package: 256-LBGA (256-FTBGA, 17×17) supports dense system layouts while remaining manufacturable with standard surface-mount assembly processes.
- Commercial Temperature Rating: Specified 0 °C to 85 °C operation for typical commercial product environments.
- Regulatory Compliance: RoHS compliance supports environmentally conscious manufacturing requirements.
Why Choose XC7A75T-1FTG256C?
The XC7A75T-1FTG256C positions itself as a versatile, commercially graded FPGA that combines substantial logic capacity, embedded memory and a high I/O count in a compact 256-LBGA package. Its specified core voltage range and RoHS compliance make it suitable for mainstream electronic products that require programmable hardware flexibility.
This device is a practical choice for engineering teams building designs that need scalable, reconfigurable logic and on-chip memory while maintaining a compact footprint and standard surface-mount assembly. Its specifications support longer-term design flexibility through reprogrammability and integration of multiple functions into a single component.
Request a quote or submit a product inquiry to receive pricing and availability for the XC7A75T-1FTG256C. Our team can provide the information you need to move your design forward.

Date Founded: 1969
Headquarters: Santa Clara, California, USA
Employees: 25,000+
Revenue: $22.68 Billion
Certifications and Memberships: ISO9001:2015, RoHS, REACH








