XC7A75T-1FGG676I

The XC7A75T-1FGG676I is an Artix-7 Field Programmable Gate Array (FPGA) IC from AMD provided in a 676-ball FBGA package. It delivers a combination of configurable logic, embedded RAM, and a high count of I/O in an industrial-grade, surface-mount package.

Key on-chip resources include 75,520 logic elements, approximately 3.87 Mbits of embedded memory, and up to 300 I/O pins, with a supply voltage range of 0.95 V to 1.05 V and an operating temperature range of -40°C to 100°C.

Key Features

• Core Logic 75,520 logic elements providing substantial programmable logic capacity for medium-to-large FPGA designs.
• Configurable Logic Blocks (CLBs) 5,900 CLBs for structuring combinational and sequential logic resources.
• Embedded Memory Approximately 3.87 Mbits of on-chip RAM to support buffering, lookup tables, and application-specific memory needs.
• I/O Count Up to 300 I/O pins to support broad peripheral and interface connectivity.
• Power Core supply range of 0.95 V to 1.05 V for compatibility with typical FPGA power domains.
• Package and Mounting 676-FBGA (27 × 27 mm) package in a 676-ball BGA format, designed for surface-mount assembly.
• Temperature and Grade Industrial grade with an operating temperature range of -40°C to 100°C suitable for temperature-demanding environments.
• RoHS Compliance RoHS-compliant construction for regulatory and environmental considerations.

Typical Applications

• Industrial Control Use the industrial operating range and high I/O count to implement sensor interfaces, motor control logic, and factory automation functions.
• Data Path and Buffering Leverage the approximately 3.87 Mbits of embedded RAM and wide logic capacity for packet buffering, data alignment, and custom data-path processing.
• Custom I/O and Protocol Bridging Utilize up to 300 I/O pins to implement protocol conversion, glue logic, and multi-interface bridging in embedded systems.

Unique Advantages

• Significant Logic Capacity: 75,520 logic elements enable complex finite-state machines and custom datapaths without external logic.
• Substantial On-Chip Memory: Approximately 3.87 Mbits of embedded RAM reduces reliance on external memory for many buffering and lookup tasks.
• High I/O Flexibility: 300 available I/Os provide flexibility to connect multiple peripherals, sensors, and high-density connectors.
• Industrial Reliability: Rated for -40°C to 100°C operation to meet the demands of temperature-challenging deployments.
• Compact Surface-Mount Packaging: 676-FBGA (27×27 mm) package delivers a compact footprint for board-level integration while supporting high-density interconnect.
• Regulatory Compliance: RoHS-compliant construction supports environmental and manufacturing requirements.

Why Choose XC7A75T-1FGG676I?

The XC7A75T-1FGG676I provides a balanced mix of logic resources, embedded memory, and I/O capacity in an industrial-grade FPGA package. Its combination of 75,520 logic elements, approximately 3.87 Mbits of on-chip RAM, and up to 300 I/Os makes it suitable for designs that require substantial programmable logic and interface density within a surface-mount 676-FBGA footprint.

Engineers designing industrial systems, data-path modules, or complex interface bridges will find this device applicable when a robust operating temperature range and a compact BGA package are required. The part’s specifications support scalability of logic and memory resources while meeting regulatory and assembly requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the XC7A75T-1FGG676I. Our team can assist with lead times and volume pricing details.