XC7A75T-1CSG324C

IC FPGA 210 I/O 324CSBGA
Part Description

Artix-7 Field Programmable Gate Array (FPGA) IC 210 3870720 75520 324-LFBGA, CSPBGA

Quantity 1,274 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package324-CSPBGA (15x15)GradeCommercialOperating Temperature0°C – 85°C
Package / Case324-LFBGA, CSPBGANumber of I/O210Voltage950 mV - 1.05 V
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs5900Number of Logic Elements/Cells75520
Number of GatesN/AECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits3870720

Overview of XC7A75T-1CSG324C – Artix-7 FPGA, 324-LFBGA (210 I/O)

The XC7A75T-1CSG324C is an Artix-7 field programmable gate array (FPGA) IC designed for commercial-grade applications. It delivers a balance of logic capacity, embedded memory, and I/O density in a compact 324-pin CSPBGA package suitable for surface-mount assembly.

This device is appropriate for designs that require substantial on-chip logic and memory while operating within a standard commercial temperature range and low-voltage core supply.

Key Features

  • Logic Capacity — 75,520 logic elements provide substantial programmable logic resources for complex digital designs.
  • Embedded Memory — Approximately 3.87 Mbits of on-chip RAM to support buffering, state storage, and intermediate data processing.
  • I/O Density — 210 available I/O pins to support multiple interfaces and peripheral connections.
  • Power — Core voltage supply range of 0.95 V to 1.05 V for core power planning and supply design.
  • Package and Assembly — 324-LFBGA / 324-CSPBGA (15x15) package in a surface-mount form factor for compact PCB layouts.
  • Operating Range — Commercial operating temperature range from 0 °C to 85 °C for standard commercial applications.
  • Environmental Compliance — RoHS compliant.

Typical Applications

  • Custom Digital Processing — Implement application-specific logic where up to 75,520 logic elements and on-chip RAM are required for algorithms and data paths.
  • Interface Aggregation — Support designs needing a large number of external signals with 210 I/O pins for bridging and protocol translation tasks.
  • Embedded System Control — Use as the programmable control element in commercial embedded products that operate within a 0 °C to 85 °C range.

Unique Advantages

  • High Logic Integration: 75,520 logic elements allow consolidation of multiple functions into a single device, reducing system BOM.
  • Sized Embedded Memory: Approximately 3.87 Mbits of on-chip RAM supports local data buffering and state machines without immediate external memory.
  • Ample I/O: 210 I/O pins enable connection to numerous peripherals and interfaces without adding I/O expanders.
  • Compact Surface-Mount Package: 324-LFBGA / 324-CSPBGA (15x15) package minimizes PCB footprint while providing a high pin count.
  • Commercial Operating Range: Rated for 0 °C to 85 °C to match standard commercial deployment environments.
  • Regulatory Compliance: RoHS compliance supports environmentally conscious product design and manufacturing.

Why Choose XC7A75T-1CSG324C?

The XC7A75T-1CSG324C positions itself as a capable Artix-7 FPGA option for commercial designs that need a substantial mix of logic, embedded memory, and I/O in a compact surface-mount package. Its specification set makes it suitable for integrators seeking to consolidate functionality onto a single FPGA while maintaining standard commercial operating conditions.

For teams focused on scalable, programmable hardware solutions, this device offers verifiable on-chip resources and a common packaging footprint, helping streamline PCB design choices and supply planning.

Request a quote or submit an inquiry to get pricing and availability for the XC7A75T-1CSG324C. Our team can provide lead-time and procurement support tailored to your project needs.

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